Electronics Forum | Tue Oct 19 10:53:14 EDT 1999 | Carol Zhang
Hi, I tried to use high temperature solder (540 - 570F)to connect four spacers on the board. The solder mask around the spacers wrinkled a lot.I can even see a few bulbs around it. I use hot plate and solder rings. After hot plate is heated to appr
Electronics Forum | Wed Oct 13 03:11:10 EDT 1999 | Paul Gerits
Hi Zambri, I work for Philips EMT (supplier of SMT equipment) as technical consultant and application specialist. depending on what you want to know there are several ways to calculate machine utilisation. 1) Machine efficiancy. Available uptime
Electronics Forum | Fri Oct 08 16:48:24 EDT 1999 | Charles Morris
| I recently had the opportunity to visit the vendor who is making my boards. On my trip I noticed that the guy who was in charge of the SMD placement machine (brand new Samsung) still had to manuallly place about 20%-40% of the parts after placement
Electronics Forum | Fri Oct 08 17:03:03 EDT 1999 | Dave F
| Hi, | | Help! Could anyone help to enlighten me on this? | | Question: | | If I have a CSP/BGA package of size X by Y and the standoff gap between the component and PCB is Z, What is the maximum allowable Y/Z or X/Z that using a normal water cl
Electronics Forum | Sun Oct 03 21:36:57 EDT 1999 | JAX
| What are pro's and con's of reflowing top side first and curing bottom side chip components, and then wave soldering bottom side? | | How about curing bottom side first and reflowing top side later? | | What percentage of companies run reflow/cur
Electronics Forum | Fri Sep 24 09:48:28 EDT 1999 | Shane
I am developing a DOE for evaluating SMT adhesives. I would like to evaluate 3 different vendor dispensing adhesives. I currently have the Heraeus PD955M and the Loctite 3609 and 3618 selected for evaluation. I would like to add another manufactur
Electronics Forum | Tue Aug 31 20:51:20 EDT 1999 | Raeto Zryd
Dear fellow process engineers, Some solder joints "trough hole component" have cracked. I suspect that in the market some technician tryed to straighten some components (LED) and has applied enough force to actually brake the joint. The joints were
Electronics Forum | Wed Sep 01 13:48:29 EDT 1999 | Dave F
| Dear fellow process engineers, | | Some solder joints "trough hole component" have cracked. I suspect that in the market some technician tryed to straighten some components (LED) and has applied enough force to actually brake the joint. The joints
Electronics Forum | Tue Aug 24 04:05:15 EDT 1999 | Scott Davies
| Hello everyone, | We found many cylindrical diodes missing during SMT process. Could someone tell us how to prevent this problem? Is it effective to change the shape of stencil apture or reduce fan speed in reflow oven? Thanks in advance. | | Gyve
Electronics Forum | Thu Jul 29 11:39:34 EDT 1999 | Justin Medernach
| We are going to smt ic's on the component side of our pcb's. | The problem is we are going to have to do this by hand. | We have a hot air station and vac pencil, but How reliable is this process. | We've tried it on proto's and had some shorting p
