Electronics Forum: component (Page 531 of 1140)

Can We Check Our Units??

Electronics Forum | Fri Jul 24 10:36:48 EDT 1998 | Dave F

| | Hi, | | We have encountered one serious problem that heavy packages falling down during second side reflow, especially for PLCC 84. I believe it caused by temperature profile setting. | | Any good suggestion would be highly appreciated! | | Stone

Re: Interest in Bulk Feeding

Electronics Forum | Tue Jun 23 09:26:11 EDT 1998 | Stefan Witte

| What is the level of interest in bulk feeding cpassive devices, caps & resistors, 0402,0603,0805? The component mfgs. tell me in 3 years 40% of the passive caps will be bulk fed. Their is currently about a 10% cost savings with bulk over tape & r

Re: Looking for Procedures for SMT repair

Electronics Forum | Thu Jun 18 21:13:22 EDT 1998 | Dave F

| I am looking for a quickly obtainable procedure on the repair of SMT boards. I am particularly interested in discrete components, such as | capacitors and resistors. | I need to know the importance of pre-heating the board and components. What is

Re: Looking for Procedures for SMT repair

Electronics Forum | Fri Jun 19 21:00:20 EDT 1998 | Dennis O'Donnell

| | I am looking for a quickly obtainable procedure on the repair of SMT boards. I am particularly interested in discrete components, such as | | capacitors and resistors. | | I need to know the importance of pre-heating the board and components. Wh

Re: HASL VS. OSP

Electronics Forum | Wed Jun 10 17:18:47 EDT 1998 | Igmar Grewar

| Okay, here's a stupid question. What exactly is HASL and OSP? We are going to delve into this technology where I work and I want to utilize the wealth of knowledge here to make life easier. Specifically, what are the differences, the advantages, di

Re: SMT process benchmarks??

Electronics Forum | Wed Jun 10 14:48:12 EDT 1998 | Chrys

| | Does anyone have any info./studies on what the percentage or PPM defect rates are for each part of the typical SMT process. | | Example: | | Screen Print = 45% of total defects | | Component Placement = 25% of total defects |

Providing Thermal Relief On Vias

Electronics Forum | Wed Jun 03 13:51:57 EDT 1998 | Dave F

Hello: BACKGROUD: SMT components soldered on the top-side of boards that also require wave soldering have the potential to reflow during wave soldering. Reflowing these components during wave soldering is not good. It can cause cold joints, opens

Re: 15G PQFP

Electronics Forum | Tue Jun 02 12:58:07 EDT 1998 | Michael Allen

"...the part is aligned to the pads with in 10% before going into the IR oven." Sounds like the pad pitch might be okay (?). If that's not the problem, then what? I wish I had the answer, because I've struggled with heavy QFPs for some time now (2

Re: Leader Tape for SMT components/Source, but why?

Electronics Forum | Tue Jun 02 17:52:06 EDT 1998 | Dave F

| Is there someone who can tell me where I can buy rolls of leader tape for SMT component tapes. Is there a good way of bonding leader tapes, maybe a special instrument to do the job. Thanks for any help. Igmar: The following companies supply SMT co

Re: Component Baking

Electronics Forum | Fri May 22 11:12:25 EDT 1998 | Mike Glenn

| | Does anyone know about low pressure/low temperature | | ovens used for baking of moisture senstive | | components? | | Thanks | I need to know from where your need came. I usually just bake in conventional ovens with specified times and tempera


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