Electronics Forum | Fri Apr 16 08:49:07 EDT 2004 | Chris Lampron
Hi Barry, Your best course of action is to perform a thermal profile and determine exactly what the times/temps are in these locations. Try to match your profile to the recommendations of your solder paste. (Time between 130-160, Time over 183 and m
Electronics Forum | Thu Apr 22 12:27:47 EDT 2004 | barry
I placed thermo's at 2 of the problem devices. Soak (time 150 to 180) 100 sec. Time above 180 =80 secs with 208 deg. peak. The solder appeared to flow at these pads, but little to no adhesion to the joint.Total time in oven was 5 min. All other joint
Electronics Forum | Fri Apr 23 13:56:57 EDT 2004 | Robert
Hi all Does any one know problem with solder joint call crystallised joints. I have noticed that sometimes on our PCB when i look at the joints for example chips, LCCC, there are areas not smooth solder (very often in the center of the solder joint)
Electronics Forum | Wed Apr 28 12:13:57 EDT 2004 | Jack
You can find the procedures for different package types in the IPC-7711 & 7721 manuals. These can be purchased from the IPC.[http://www.ipc.org/] You can also try Circuit Technology: http://www.circuittechctr.com/guides/guides.shtml These manuals and
Electronics Forum | Wed Apr 28 10:29:04 EDT 2004 | dougt
By "placement pressure" I assume you mean force. I don't know of placement machines that have transducers mounted on the placement spindles that actually measure force. We made a board with a force sensor mounted through a hole so that it was the sa
Electronics Forum | Mon Apr 26 15:10:46 EDT 2004 | pjc
Parylene coating is done in vacuum curing chambers. This process drives the material under components and into all nooks and crannies. There is nowhere on the board assembly that can escape from the material! I've only seen Parylene coating process u
Electronics Forum | Wed Apr 28 10:26:29 EDT 2004 | mrmaint
Hello All, I am having trouble with bridges under my BGA's.I am using paste flux. The compresion on the component appears to be good but i am seeing bridges every 1 out of 5 reworked. The alignment before it starts reflowing the part is fine. Dont un
Electronics Forum | Tue May 04 14:27:32 EDT 2004 | michasm2
Both are acceptable methods. - Printing on the board may give your operators a better ability to catch insufficient solder due to poor release; however if done right, printing directly onto the BGA ball is much more efficient and eliminates any compo
Electronics Forum | Tue May 04 22:45:58 EDT 2004 | alwil
I want to find out if we can place 0201 components using a Fuji CP6-E 4000. If this is possible, do we require any upgrades to the machine. Is anyone doing this at present with this type of CP6. If so, what size of nozzle and feeder type is being use
Electronics Forum | Thu May 20 17:52:28 EDT 2004 | Grant Petty
Hi, Thanks for the info, and because both types of machines look similar, it's hard to tell which one would be best. So this kind of info really helps. What kinds of issues do you see when running each type of machine, and how reliable are they at
