Electronics Forum | Mon Aug 20 10:03:48 EDT 2007 | slthomas
Wow. Never have, never would, but that doesn't mean it couldn't be done. Mostly it just seems impossible to design a carrier clip that could hold both well...more likely it would hold one well and the other poorly, or both poorly. Anyway, is there
Electronics Forum | Mon Aug 20 12:28:41 EDT 2007 | slthomas
Is there any way to generate a printable (ASCII text)component info file? We don't have LAN capability on this machine, nor do we use PPS, and I can not for the life of me figure out how to print something to help the operator set it up. Worst case i
Electronics Forum | Sat Aug 25 08:24:15 EDT 2007 | davef
We're unfamiliar with such component dryout requirements. Commonly, tape & reel cover tape will seperate at 60*C. So, even if your baking on a metal reel, your should keep the bake temperature ~40*C. Sure makes you want to use these parts during th
Electronics Forum | Fri Aug 24 13:46:35 EDT 2007 | consultacionbc
I'm currently looking for a tool to be able to convert TH components to SMT. Looking at each datasheet is to time consuming, we will be needing to convert TH to SMT for a customer. Their bards have approx. 3000 parts TH. We've got the Arrow to find
Electronics Forum | Tue Aug 28 23:53:31 EDT 2007 | crashoveride
dedicated fixture works best if the board is very much populated. But if the parts to be inserted are less than 300components, adjustable fixtures may be used. But the secret of good insertion is a precisely measured tooling pin to prevent the boards
Electronics Forum | Wed Sep 05 10:37:22 EDT 2007 | stepheniii
While I agree with Realchunks, the joints do have to at least have to hold the parts on the board. So your test might have had another purpose but it would also be testing if they had enough mechanical strength to hold the components on. Drop an unre
Electronics Forum | Wed Sep 05 08:06:08 EDT 2007 | davef
The gold needs to go into the solder so the solder can form a connection between the the component and the nickel under the gold. The gold will disperse into the solder. Most of it will remain in your solder pot after board processing. Assess the c
Electronics Forum | Fri Dec 14 08:06:39 EST 2007 | gcamac
I have had an inline Mirtec for around two years now and we like it overall. The false calls we see are due to the lack of consistancy of the markings on the components. This usually causes some tweeking to the library when the first piece is produ
Electronics Forum | Sat Nov 03 09:39:27 EDT 2007 | davef
Flux exhaused or CSP never came to peak temperature * BGA balls don't combine with the solder => Flux exhaused or BGA balls never came to peak temperature * 0402 surface looks like many tin balls piled together => Flux exhaused Start your thermal
Electronics Forum | Wed Nov 07 18:11:44 EST 2007 | jmelson
I can't answer for wave, but we tried some Sn100 paste for reflow, and couldn't get it to work worth a darn. I then got some SAC305, and was relieved to see it work almost as well as SnPb at its best! Much better wetting and flowing to the various
