Electronics Forum: component (Page 686 of 1140)

Red-E-Set Support Damaging Double Side Components on DEK

Electronics Forum | Wed Sep 30 11:39:20 EDT 2020 | dontfeedphils

I used it years ago on an old semi-auto printer and thought it was alright for the application and asking price. Set it up once with a sample board, which takes maybe 5 minutes, and you should be set for the entire run. I still prefer something mor

Does anyone have experience with LOCTITE ECCOBOND Underfill?

Electronics Forum | Fri Oct 02 11:02:24 EDT 2020 | proceng1

Do you preheat the board? Do you apply on two sides and let it fill under, or along all 4 sides? Does it bleed away from the part as well, or does it wick under the part during reflow? Basically, we've never used underfill before. So I don't know

New to solder paste jetprinting

Electronics Forum | Thu Oct 08 11:41:19 EDT 2020 | essusa

Not a sales pitch, just an update, the Essemtec jet print solution is maturing fast based on a lot of customer testing. It is fully capable to replace printers for prototyping and NPI. Being adaptive to different paste suppliers and different compone

FLEXI-TERM Components

Electronics Forum | Tue Jan 19 19:41:09 EST 2021 | rgduval

Double check your p/n and your datasheet, and with your supplier. I had this happen one time, though it wasn't with flexi-term parts. Mine ended up being palladium plated end-caps (my buyer and receivers had all missed the applicable suffix issue o

FLEXI-TERM Components

Electronics Forum | Mon Jan 25 13:39:51 EST 2021 | grahamcooper22

Thanks for your reply. According to the manufacturer there isn't any palladium under the solderable coating on the chips...just nickel....i guess maybe the nickel is heavily oxidised. I have experienced the poor solubility (zero solubility at 210 deg

Bright Tin metalisation on CHIP components

Electronics Forum | Fri Jan 22 13:22:18 EST 2021 | davidhillman

Hi Graham - brite acid tin gets it "shiny" appearance due to codeposited organic material in the tin plating. The codeposited materials volatilize during the soldering process causing a ton of voids. Brite acid tin plating should not be used as a sol

step stencil

Electronics Forum | Fri Feb 05 02:40:40 EST 2021 | victorzubashev

For components with the large pads, you can also use secondary soldering dispensing. Some printers like DEK have an option to mount a syringe with an auger valve to do dispensing after the printing step process. Obviously will not work if you have to

New production using only MPN (manufacturer part number) for programming pp machine

Electronics Forum | Thu Feb 04 13:28:45 EST 2021 | SMA_01

Hi. We are starting production with brand new systems and we wont /cant be using our own Internal Part number (IPN) components for this production. I was thinking if we should only use Manufacturer part number (MPN) for programming. Does anyone have

What defect in SMT will be cuased by dust contamination?

Electronics Forum | Thu Oct 21 13:08:38 EDT 2021 | ademrah

Hi, It depends on smallest pitch size of your components. For the 0.3 um, 0.5 um, etc. sizes could be mentioned on Clean Room. For example; for ISO-7 standart (Class 10,000) higher than 5um is not acceptable, however 1mm can acceptable to describ

SAC305 preforms not wetting to ENIG pad in fluxless process

Electronics Forum | Wed Apr 28 06:26:15 EDT 2021 | jeremy_leaf

@Evtimov I can't use flux as the components being soldered can't cope with any contamination whatsoever. Even an ultra low solids no-clean flux will be too much. I also can't clean the boards after soldering due to any residual contamination from the


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