Electronics Forum: component (Page 696 of 1140)

Re: Tombstoning 0805s w/palladium/platinum/silver terminations

Electronics Forum | Sun May 02 18:52:36 EDT 1999 | JohnW

| Tombstoning 0805s w/palladium/platinum/silver terminations | | We are experiencing tombstoning problems on 0805 packages that have paladium/platinum/silver terminations. It comes & goes...... | | I�ve checked the reflow profile, and paste deposi

Re: Paste-in-Hole

Electronics Forum | Fri Apr 23 04:02:22 EDT 1999 | Scott Davies

I need to know if there are any special component pad designs that need to be considered when evaluating paste-in-hole? We have a few through hole connectors that are good candidates to place pre reflow. Does anyone have sugguestions. Thanks Chri

Re: Good Solder Joint Failures

Electronics Forum | Tue Feb 16 12:14:12 EST 1999 | Gregg Reick

| Hope some of you out there can help me with this one. | I am getting feedback from our test department that they are showing opens on solder joints which have visually good wetting. The touch-up operators confirm that the joint looks good. All they

Re: SMD mounting method

Electronics Forum | Fri Feb 05 09:22:25 EST 1999 | Dave F

| | | Joni: What is it about your situation with the board/component/process that makes you want to explore alternatives? Dave F | | Dave: In our case the component is placed on metalled footprint which has via holes to transfer the heat via hole

Re: BGA PROFILE

Electronics Forum | Tue Feb 02 09:47:45 EST 1999 | Justin Medernach

| Hi everybody. | Somebody know any consideration or special care to make a profile for BGA's. | | any advice is aprecied. | | thanks | Al Carrillo | | Hi Al, A BGA should be looked at just like any other surface mount device. However, just

Re: BGA PROFILE

Electronics Forum | Tue Feb 02 17:51:45 EST 1999 | gcollier

| | Hi everybody. | | Somebody know any consideration or special care to make a profile for BGA's. | | | | any advice is aprecied. | | | | thanks | | Al Carrillo | | | | | Hi Al, | A BGA should be looked at just like any other surface mount d

Re: Moisture Sensitivity and Package Cracking

Electronics Forum | Tue Feb 02 11:07:36 EST 1999 | justin.medernach@flextronics.com

| Greetings, | | We are discussing what should and what should not be baked and vacuum packed. Should we just concentrate on the fine pitch packages and the bga's? | What about those components which come on blister tape, should they get baked and r

Re: Why so little interest in Bulk Fed passives?

Electronics Forum | Fri Jan 08 09:25:40 EST 1999 | H. van Leeuwen

| If passive componets are cheaper why aren't they more popular? Manufacturers like Murata and AVX claim availability and substantial cost savings but little interest seems to exist. Why? Your input is greatly appreciated. | Good question... I work

Re: Shot in the dark BGA 560 ?

Electronics Forum | Wed Dec 02 21:58:19 EST 1998 | Dave F

| | I am looking for a few PBGA 560 1.27 pitch Components. If anybody has any lying around I could buy. So that I may profile to my hearts content. | Thanks | Mike Cox | Mike: The best I can offer is contacts at dummy component suppliers, wh

Re: Reel Cabinets

Electronics Forum | Sat Nov 07 03:06:03 EST 1998 | Gary Simbulan

| | | What are you people using to store component reels and tubes in? I am looking for a cabinet with slots or something to store reels and tubes. We keep our components on the production floor near the machines. The cabinets we are using now are


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