Electronics Forum: component (Page 711 of 1140)

DEK pro-flow

Electronics Forum | Fri Feb 16 09:30:38 EST 2007 | DEK Answer Guy

Hello PR, PumpPrint� technologies enable high throughput adhesive deposition using a screen printing platform. Careful selection of stencil material, and informed study of the design of apertures and other stencil features, enables a wide range of

SMT REWORKING ( BGA )

Electronics Forum | Mon Apr 16 09:01:18 EDT 2007 | Steve

The best station I've ever worked with is a focused IR station from PDR. The station that I had was called a; "Lightmaster Pro". They have a different model name now, but you can see a datasheet for it at: http://www.pdr.co.uk/Datasheets/PDRX410-IR-

SMT placement machines. Where are we going ?

Electronics Forum | Fri Jun 12 15:29:51 EDT 2009 | grantp

Hi, We just had delivered one of these and it's incredible. It's an amazing machine, and watching it load such a large board totally accurately, from end to end is amazing. Apparently we took delivery of only the second machine to ship in the world

Black color solder wetting after reflow

Electronics Forum | Fri Apr 29 14:16:16 EDT 2011 | ppcbs

Below is the long explanation. This defect is most commonly found with BGA components, but can arrise with all components. I see it happening more now with lead free boards that are being assembled with a no clean flux. Best short term remedy is t

Typical placement speeds - please advise

Electronics Forum | Mon Jul 14 11:59:41 EDT 2014 | rgduval

I've primarily used MyData equipment, personally, and, optically centered devices definitely take longer than mechanically centered parts on a MyData, owing to the construction of the machine. With a fixed upward looking camera, the head has to pick

solder paste printing

Electronics Forum | Fri Mar 29 10:11:02 EDT 2019 | cyber_wolf

“For a number of years now, work has been proceeding in order to bring perfection to the crudely conceived idea of a transmission that would not only supply inverse reactive current for use in unilateral phase detractors, but would also be capable of

Re: Oven Temperature for Solder Reflow

Electronics Forum | Sun Aug 08 20:59:55 EDT 1999 | Dreamsniper

| | | What oven temperature should be used to reflow solder (Sn63Pb37) on a PC board (0.075" to 0.100" thickness) in 5 to 10 minutes? | | | | Profiling - tedious but important. As said, start with the paste manufacturers recomendation which is usua

Re: Tinning gold plated leads ( DIP, etc)

Electronics Forum | Tue Mar 21 20:25:30 EST 2000 | Dave F

John: What�s the matter? Free gold � good thing for you, bad thing for your supplier. :^) Pre-tinning of gold plated leads is important to: � Prevent gold embrittlement of the solder joint � Determine if the leads are solderable prior to assembly (

Re: Solder surface tension

Electronics Forum | Tue Oct 12 05:09:13 EDT 1999 | Brian

| | | | | | | Can anyone tell me the formula/method to determine | | | | | | | the amount of weight that solder's surface tension can support. | | | | | | | (ie: Maximum weight of components soldered onto a bottom side | | | | | | | of a board during

Re: Conductive Epoxy

Electronics Forum | Fri Dec 04 13:25:34 EST 1998 | Jeff Sanchez

| | | | Does anyone have any information or experience with the use of conductive epoxy in leu of solder. I have a unique application that might lend itself to this technology. I am looking for manufacturers, printing, curing and reliability info. |


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