Electronics Forum | Tue May 02 11:05:38 EDT 2006 | grantp
Hi, Who cares, lead free is not going away, and unfortunately that "lets just hope lead free goes away" attitude has permeated a lot of US based suppliers, and now we are in real trouble, because parts availability currently is a total mess. It see
Electronics Forum | Fri May 26 06:48:11 EDT 2006 | Mity-C
Good Morning, We also have several Mirtec M2HTL's. They have been responsible for taking SMT off of the defect radar screen. We are also using one to verify the through hole auto insert process. I have been told by our President that the Mirtec's we
Electronics Forum | Fri Jun 16 20:40:43 EDT 2006 | mika
Hi Grant, I understand your concerns about the reliability. It depends what the boards are use for. For ex. if it is in a telecom system market where lifetime and reliability is a big issue 10-20 years lifetime (our customer reqs. that at the system
Electronics Forum | Fri Jul 28 06:16:20 EDT 2006 | pavel_murtishev
Good afternoon, We run mixed LF/SnPb process for most of out products. Most of chip passives have lead free termination and some of them tend towards blistering issue. SnPb solder wets component in very strange way. Wetting phenomena seems to be abn
Electronics Forum | Fri Aug 04 12:16:41 EDT 2006 | Wave Master Larry
LISTEN Dr Shocker. you're a doctor of what again? That's what you get for having those god awful Vecra machines.We've got a couple of those at my place of employment and I tell ya I hate that new fangled windows software that it runs on. I would say
Electronics Forum | Thu Sep 28 09:19:05 EDT 2006 | realchunks
Apart from recommending a placement machine since I don�t know you product, part mix or tact time; I would just like to point out a few other things to consider when choosing a different placement machine. Feeders are a big thing. Mydatas are good
Electronics Forum | Thu Oct 26 10:29:03 EDT 2006 | Mike
First, Voiding under thermal pad is unavoidable(pardon the pun), unless you can find a way to add sufficient amount of solder paste to cover the area, and match that solder volume on your terminal leads. I build HVM qty's of "QFN" components w/ therm
Electronics Forum | Thu Oct 12 16:55:19 EDT 2006 | realchunks
This type of testing is only done to verify your reflow process. It is destructive testing and should not be performed on product reaching your customer. Solder is only used to provide the electrical connection from part to board. As a metal it is
Electronics Forum | Wed Jan 10 20:06:43 EST 2007 | SSS
I've been assembling thousands of boards for dozens of customers over the past 5 years with 0402 chip components. 85% can happen very easily even with newer equipment. Defect challanges with 0402 packages is almost always tombstoning. Capacitors abou
Electronics Forum | Mon Jan 29 10:50:35 EST 2007 | mika
What about the component placement with Head #2? Head # 1 is ok? Is it only the pickup that is the problem and if so, from all feeder banks (front & Rear)? Concider Z-axis height adjustment, procedure is in the manual. You normally don't need to re-
