Electronics Forum: component and minimum and requirements (Page 1 of 11)

Component pad design and volume requirements

Electronics Forum | Tue Feb 15 14:35:41 EST 2000 | Balas

hi I am designing a test vehicle with a range of components on it(pbga, cbga,fc, mbga, and qfps). My concern is that I would like to use a single stencil for solder deposition and not a stepped stencil. That would require me to have aperture design a

Heat guns and component damage

Electronics Forum | Tue Jan 31 15:15:13 EST 2006 | russ

Heat guns used improperly will definitely damage components. You must have a controlled heat gun that can be set to the max temp you want pb =215C max, Pbfree maybe 240C max. This heat gun must not be able to be adjusted or you must have total trus

Clearance between Through hole and chip component

Electronics Forum | Tue Feb 27 11:03:09 EST 2007 | Marcin

Hi All, Anybody knows what is the minimum clearance between through hole component and chip component? Problem description: On bottom side of my pcb are only 0603 chip components mounted on glue. One of the component is located very close to hole

Clearance between Through hole and chip component

Electronics Forum | Wed Feb 28 00:01:47 EST 2007 | Muhammad Haris

Hi, The distance between the two terminations/endings/pads of 0603 (0201)is 0.15mm i.e. lesser than than the distance between the 0603 and through hole i.e. 0.5mm My ques is that, then why its termination doesnot short as it has a minimum distance.A

The minimal distance btw component and the edge of pcb

Electronics Forum | Sun Oct 09 16:57:30 EDT 2016 | davef

IPC 2222A Sectional Design Standard for Rigid Organic Printed Boards, 5.3 Design Requirements for Printed Board Assembly

Tinned leads and where the component body is defined

Electronics Forum | Thu Sep 03 22:03:32 EDT 2020 | SMTA-64386139

Both conditions are acceptable for this bottom brazed flat pack package. The solder coverage must be within 0.070 inch of the lead/package interface per MIL-PRF-38535, paragraph A3.5.6.3.4.a. While that requirement could allow for a gold gap near t

SMT Design: Package distance and stand-off height

Electronics Forum | Wed Nov 12 04:34:17 EST 2008 | kywl

Hi all, Assuming that i were to design a PCB and there are multiple components, what is the minimum spacing required to ensure that i won't have problems in my SMT process later on? Also, is there a minimum component stand-off height spec as well?

Solder climbs on the lead and touches the body of the component

Electronics Forum | Wed May 14 18:22:07 EDT 2014 | hegemon

Dave is touching on one of those magical things that keeps us process engineers well paid and dancing (Well, some of us, lol). Heavy boards with light components. Solder Follows heat. Component heat up earlier. Repeat, Solder follows the heat. Care

Board Stacking and Conveying

Electronics Forum | Mon Mar 26 16:58:53 EDT 2018 | solderingpro

Is there anything stopping you from replacing the flat belt solution to a continuous running steel roller chain conveyor? - From there (depending upon board temperature) you should be able to buffer your boards in a vertical buffer station if neede

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Electronics Forum | Wed Oct 07 11:51:51 EDT 1998 | Clifford Peaslee

You may have noticed that we have started using cookies on the site, and I wanted to explain the importance of cookies. Cookies are used at SMTnet to facilitate future enhancements of the site like personalizing your experience while browsing our si

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