Electronics Forum | Mon Oct 21 23:48:13 EDT 2002 | harris
Hi: If anyone have the experience with the PCB pad design and stencil design for the uBGA? We meet the problem for it. The component data is 0.3mm diameter and 0.5 pitch. Could anyone tell me the PCB pad dimension, the stencil type and aperture dimes
Electronics Forum | Wed May 10 01:00:09 EDT 2000 | gary
0.65mm pitch QFP. I believe that this is the borderline for Fine Pitch. Will I have a good paste release with Chem-etch matched with a rubber squeegee? I'm planning of a 15% reduction on the Width and no reduction on the length. Any feedback whether
Electronics Forum | Wed Sep 18 12:31:16 EDT 2002 | dragonslayr
My suggestion is to conduct a Design For Manufacturing (DFM)study on the assembly in question. Pay particular attention to the pad sizes, component lead dimensions and satisfy yourself that those two factors are correct. Given that pads match compone
Electronics Forum | Tue Jan 08 09:23:18 EST 2013 | lock_2002
This is a question regarding soldermask between pins of fine pitch devices. The majority of our production designs end up with at least 2-3 mils of copper thickness on the external layers due to blind vias, wrap plating requirements, etc. Our curre
Electronics Forum | Wed Sep 18 18:41:17 EDT 2002 | davef
People have made good comments. Additional points are: * Your bridging is probably being caused by one or more of the following: [1] printing too much paste, [2] smearing the paste during placement or subsequent handling, or [3] paste slump during t
Electronics Forum | Wed Sep 18 12:35:56 EDT 2002 | stepheno
Fourth - > back to design of PCB. Are there solder dams of > mask between the pads? If yes, that helps. If > not, pay close attention to stencil aperture > width and be sure that the aperture deposits less > paste by 1-2 mils per pad, centered o
Electronics Forum | Mon Jun 12 17:32:17 EDT 2006 | flipit
Hi, A little off subject but I just finished a quick little experiment where I placed 0201 to 1206 and some ceramic resonators at specific distances off the scored edge. The distances from scored edge ranged from 0.025" on up at 0.025" increments.
Electronics Forum | Tue Jan 31 14:30:38 EST 2006 | Chunks
There is none, since we don't know your part or temp being used. A heat gun CAN be used to remove parts with no damage, if its controled. You need to look up your part on the manufacturers web site, find the process data (time/temp)the part is desi
Electronics Forum | Wed Sep 18 20:55:33 EDT 2002 | scottefiske
I'm with you dave...please provide specifics as to defect condition... Are you getting good wetting to both land and lead? Is there any repeatability to lead/location/device? Do you have paste inspection capabilites to verify deposition? Is it a Pala
Electronics Forum | Thu Sep 19 12:08:39 EDT 2002 | ccross
I would like to thank everyone for their time and replies
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