Electronics Forum | Sun Jan 23 17:26:48 EST 2011 | piter
Hi In my experience try to change component to another batch or anther manufacturer it is very often problem in reflow when components have strange finish
Electronics Forum | Mon Jan 24 06:19:04 EST 2011 | fönsi
Hello! I've had the same problem about one Jear ago. We had exessive building of voids in the solder joints. I recomment to take a pincer to break off some of the components. If the solder joint is good, the copper pad will stay at the solder joint
Electronics Forum | Wed Jun 26 19:42:44 EDT 2019 | bane016
Have some option to fix it by glue with dispenser? Did you check mby that component touch something inside oven?
Electronics Forum | Fri Sep 06 16:24:36 EDT 2019 | linux
We use similar switch and the same oven. You need to modify the stencil, increase surface area. Have modified all our stencils to the point where we no longer use inline glue dispensers for any product
Electronics Forum | Sat Jan 06 02:12:36 EST 2007 | backbenchers
i have 1 customer using our reflow oven, he is facing the problem that after taking the boards from reflow oven ICs & some resistors felt down.they are using our glue dispenser also, the glue is not fixed with the component. wht will be the solution
Electronics Forum | Thu Aug 24 15:37:50 EDT 2006 | Chunks
Hi Any, This is from an earlies thread "Solder Ball After Reflow Process". Date: August 16, 2006 01:52 PM Author: Russ Subject: Solder Ball After Reflow Process Oven settings are meaningless here. What does the board see? It is the paste we a
Electronics Forum | Mon Jul 06 18:00:16 EDT 2015 | jwqc
Does any one know how to calculate BGA height change after reflow oven? I guess the calculation will be based on the component size, weight, ball diameter and ball count of the BGA, but how to get the actual height?
Electronics Forum | Tue Jul 07 10:25:03 EDT 2015 | swag
Dial indicator on a post/base. You might need a fine point tip to get between adjascent components and the BGA. Or... if you're real fance schmancy you could use a CMM if you have one.
Electronics Forum | Wed Aug 30 00:16:15 EDT 2000 | Craig
We are reflowing ceramic resonators and are finding their tops falling/popping off when handling the pcbs during final assy. The epoxy seems to be coming off the components base and adherring to the lid. The components are "RFM resonators", case type
Electronics Forum | Wed Aug 30 14:57:43 EDT 2000 | John Thorup
Hello Craig Are code dates other than these two coming apart or do they stay together? If other dates stay together you should get together with RFM. Did the process work before and and the defects just start happening? These are pictured on the RFM