Electronics Forum | Mon Aug 24 21:16:57 EDT 2020 | smith88
I am trying to teach a class and the question came up about loss of metalization of the Earth pad on a chip filter. This pad is on the side of the component. I can not find a IPC call out for this type of side termination other than 3 or 5 sided 9.1.
Electronics Forum | Thu Mar 13 09:23:26 EST 2003 | jrloudenjr
What types of systems/procedures are normally used or followed to allow for scrap percentages typically from a 43,000cph placement machine.
Electronics Forum | Thu Mar 13 14:51:23 EST 2003 | juan_ruiz
A good standard could be 99.7% of Pick up reliability in terms of machine performance, but you should take care of the cost of the parts that you are scraping.
Electronics Forum | Fri Mar 19 11:01:42 EST 1999 | Dave F
| Hi folks, | | I am looking for inputs on a long-standing problem encountered in our shop: Bottom-side parts (passives) falling off in the Wave...where the only remnants of the part is a flattened glue dot of proper diameter and volume, and somet
Electronics Forum | Fri Mar 19 07:24:38 EST 1999 | John
| | | | Hi folks, | | | | | | | | I am looking for inputs on a long-standing problem encountered in our shop: Bottom-side parts (passives) falling off in the Wave...where the only remnants of the part is a flattened glue dot of proper diameter and
Electronics Forum | Fri Mar 19 05:08:24 EST 1999 | Vinesh Gandhi
Hey Marc, I am not sure about the kind of process you are following. Is it Gluing+paste printing on the bottom side or just gluing on the bottom side and paste printing on the top side. The relationship which I could think of between Bottom side
Electronics Forum | Mon Mar 22 18:03:15 EST 1999 | Marc
| | | | | Hi folks, | | | | | | | | | | I am looking for inputs on a long-standing problem encountered in our shop: Bottom-side parts (passives) falling off in the Wave...where the only remnants of the part is a flattened glue dot of proper diamet
Electronics Forum | Fri Jan 04 15:27:04 EST 2002 | davef
There is no standard. Component loss is a function of many factors, including: * Component type. * Component packaging. * Machine capabilities. * Feeder maintenance. Search the fine SMTnet Archives on attrit* for some guidelines.
Electronics Forum | Tue Jan 13 11:25:42 EST 2009 | wbrenner
Is there a general guideline for component purchasing of extra parts over required amount due to SMT process loss, ped, damaged etc.?
Electronics Forum | Wed Sep 13 11:23:37 EDT 2006 | teamcanada
Is there any published info on acceptable losses in SMT assembly. Especially for small to medium sized production runs with switch overs several times weekly Different losses for component sizes and packaging? Thx Vaughn
