Electronics Forum: component popped off (Page 1 of 149)

Skewed and popped components

Electronics Forum | Fri Sep 26 12:57:09 EDT 2003 | Angie

We have had some components that popped off in our IR oven. It was attributed to the solder paste. The humidity was above 60% the temp was about 70 degrees.

Skewed and popped components

Electronics Forum | Wed Sep 24 08:34:57 EDT 2003 | stefwitt

Even when you run a board several times, the machine may not make the same travel path every time. This in itself does not create a problem, but the vacuum on the nozzles could be different, dependent on the configuration of components on the heads.

Skewed and popped components

Electronics Forum | Tue Sep 23 23:19:34 EDT 2003 | RLW

If you have a board that you've run several times, now you run it and like before all settings are the same, but now you have 0603's randomly skewed or an inch or so away from their intended pad (as if popped up in the air), or an occasional 7343 cap

Components jumping off the board

Electronics Forum | Sun Jul 13 10:33:08 EDT 2008 | mpolak

Hello, Recently I have change our profiles. After I profile one board it look really good, within the paste spec. But I have noticed when board leaves the reflow zone and enters the cooling zone it looks like popcorn effect some components jumping o

parts popping off during reflow

Electronics Forum | Thu Sep 13 17:57:59 EDT 2001 | davef

You're correct. It is curious. Possible angles to look at are: 1 WS609 loves moisture in the air. In high humidity shops, this paste hakes-on liquid. If this is the case, you should also see slumping, resulting in fine pitch bridging, and solder

blocking off stencil apertures with tape

Electronics Forum | Wed Oct 10 20:35:17 EDT 2001 | djarvis

Stephen, I don't understand this at all mate. 1. If you don't place a QFP and get bridging across the bare pads, you were gonna get absolutely horrendous bridging if you did put one down. That points to poor printer set up or stencil design or both

MELF's falling off

Electronics Forum | Wed Oct 18 08:00:53 EDT 2006 | davef

Have you tested the solderability of the inbound components per ANSI/J-STD-002, Solderability Tests for Component Leads, Terminations, Lugs, Terminals, and Wires?

MELF's falling off

Electronics Forum | Tue Oct 17 17:27:08 EDT 2006 | adlsmt

Define "pretty easily". Did anyone ever do whatever is making them fall off now before? In most casses where a component "falls off" then someone implements a totally subjective test to make sure the rest of the parts wont "fall off" they damage a lo

parts popping off during reflow

Electronics Forum | Thu Sep 13 11:21:45 EDT 2001 | aldo_maldonado

We've had several instances of parts (1206R, SOT-23) popping off of their location during reflow. Parts placement is OK, paste brick is aligned and compact before oven. But we get random parts off their location just lying somewhere else on the boar

parts popping off during reflow

Electronics Forum | Thu Sep 13 13:34:49 EDT 2001 | Dave G

Too much Convection Airflow in the Reflow Oven blowing parts around ? Moisture Contaminated Parts out gassing ? Board out gassing? Just some thoughts, DG

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