Electronics Forum: component preforming (Page 1 of 5)

SMT component mis-aligned

Electronics Forum | Wed Feb 16 14:30:51 EST 2005 | DasonC

What kind of SMT equipment? Can U preform the Cpk study on the P&P to check your accuracy of your equipment? Otherwise, check noozle and any component jamp into the equipment. We did experience with chip jamp in the conveyor and can't hold the boa

LGA component rework process on SRT machine

Electronics Forum | Fri Jun 04 11:54:22 EDT 2021 | cbart

We do this quote often with our older Summit machine. there are a few ways to do this. all of these are assuming you have parts on the boards already and are working around them. 1- if you have a good tech that can add solder to the pads on the PCB a

Solder Balls at component side around Pin in Paste components

Electronics Forum | Thu Nov 13 12:32:12 EST 2014 | jorge_quijano

Hola, I've used the free e-book that I'm attaching when I implement the first Pin in Paste process, it was helpful. http://www.smtnet.com/Forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=17555&mc=10 One thing that was helpful was also th

Solder Preforms

Electronics Forum | Wed Aug 02 21:36:22 EDT 2006 | Lawrence

Anyone use these for soldering through-hole components? Our comapny is contemplating several options such as preforms,capital equipment like spot soldering equipment and the intrusive reflow system. We are in the process of deciding which strategy we

SAC305 preforms not wetting to ENIG pad in fluxless process

Electronics Forum | Tue Apr 13 11:41:18 EDT 2021 | jeremy_leaf

I have a SAC305 preform with which I am attempting to bond a gold coated component to an ENIG coated PCB pad. I've specified 2 microinches of gold for the ENIG. It worked previously but now with a new batch of boards, I am having an issue where the p

Rework PCB's with coins

Electronics Forum | Fri Mar 19 18:07:24 EDT 2010 | davef

That's how it's supposed to work, but is working correctly on the components that are loosing heat sinks for you? We have two choices: * Poor solderability of either the component or the heat sink ... OR * Wrong solder preform material

Re: Re-Balling BGA and BGA sockets

Electronics Forum | Wed Jan 20 20:01:27 EST 1999 | Tony Arteaga

Does anyone have information pertaining to re-balling BGA components using balls that are preformed onto disolable paper waffers (mini BGA reballing kit)? The paper containing the specific BGA device/pattern would be placed onto the BGA then pro

PIHR... what do you think...?

Electronics Forum | Mon Jun 09 14:09:06 EDT 2014 | jorge_quijano

Hola... I'm in the middle of a project to reduce assembly time in one of our products, this product has a lot of TH connectors to be soldered by hand, I'm implementing PHIR, first run has been completed, the appearance of the solder joints are obvio

Re-Balling BGA and BGA sockets

Electronics Forum | Fri Jan 15 11:25:29 EST 1999 | E. R.

Does anyone have information pertaining to re-balling BGA components using balls that are preformed onto disolable paper waffers (mini BGA reballing kit)? The paper containing the specific BGA device/pattern would be placed onto the BGA then process

Re: Re-Balling BGA and BGA sockets

Electronics Forum | Fri Jan 15 14:49:32 EST 1999 | Dave F

Does anyone have information pertaining to re-balling BGA components using balls that are preformed onto disolable paper waffers (mini BGA reballing kit)? The paper containing the specific BGA device/pattern would be placed onto the BGA then proce

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