Electronics Forum: component size (Page 1 of 111)

Increasing size tolerance to reduce component rejection

Electronics Forum | Mon Sep 26 18:53:30 EDT 2016 | chabscan

Could it be possible in my Quad 4c, to increase component size tolerance to reduce the rejection of components? Could this have an impact in the event of the machine picking a component off center? As in if the machine picks a compnent off center but

Increasing size tolerance to reduce component rejection

Electronics Forum | Tue Sep 27 11:43:32 EDT 2016 | tnisbet

Yes you can open the tolerance, and that’ll usually work for a bit. Is the LAE is linked to multiple parts? If so, then the easiest thing is to open the tolerance. If not, that’ll require another route to try. Is it happening to all of the components

Stencil and paste used for .4mm pitch csp component ball size .3mm?

Electronics Forum | Thu Aug 30 13:06:10 EDT 2018 | emeto

I don't know your board, but for this specific part: 10mil round aperture on a 3.5mil stencil with type 4 paste wold be ideal

Stencil and paste used for .4mm pitch csp component ball size .3mm?

Electronics Forum | Fri Aug 24 13:21:59 EDT 2018 | babe7362000

What do others use as far as solder paste type, stencil thickness and aperature size for a .4mm Ball Pitch CSP. Ball diameter is .3mm. Please let me know your thoughts or what you use. Thanks

Stencil and paste used for .4mm pitch csp component ball size .3mm?

Electronics Forum | Wed Aug 29 03:16:20 EDT 2018 | cannizzaro

It is recommended that the thickness of the stencil of 0.1mm, the steel mesh should be partially nano-coated. It is best not to dry easily, and the particles are not easy to be too large. I have tried ALLPCB for this kind of BGA in the past and they

Deciding On pad size using just the component footprint

Electronics Forum | Thu Jul 22 15:35:43 EDT 2004 | C.W

have you searched thru the component spec.? the component manufacturer should have the foot print guide line.

Deciding On pad size using just the component footprint

Electronics Forum | Thu Jul 22 12:02:52 EDT 2004 | lloyd

I'm currently having issues with a 28 terminal MLP package. I have only recently started in a new company and it seems as though the manufacturers guide lines as to pad geometry do not work (at least for us). So I now have a situation where I have 4

Deciding On pad size using just the component footprint

Electronics Forum | Sat Jul 24 09:06:40 EDT 2004 | davef

We believe that many manufacturers' recommended pads should be close to the last resort. Recommendations are: * Standardize with the IPC guidelines or those by Jim Blankenhorn [ smtplus.com ]. Anyone that wants to change from that standard needs to

Manual soldering - solder wire diameter and soldering iron tip size for different component sizes

Electronics Forum | Tue Apr 16 05:05:32 EDT 2013 | stivais

We recently had a discussion with customer's QM - he claims that calculations for a proper solder wire diameter and soldering iron tip size (and temperature) have to be performed and documented for all manual (T/H) solderings (based on component size

board size

Electronics Forum | Fri Mar 27 06:16:24 EST 1998 | mancheol,seo

Hello everyone~! I wonder becasuse of stencil board size. My component dimension is 200 x 200mm What the board size I choose? Please let me know solution... best regards man from korea

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