Electronics Forum: components (Page 1011 of 1140)

small and good pick and place machine

Electronics Forum | Thu Sep 05 23:18:03 EDT 2013 | feiyangniao

There is a new toy I received today: a NeoDen TM-240A automatic desktop pick and place machine! I’ve kept my eyes on this baby for a quite a while, and finally decided to make a purchase last week. The shipping was very fast: DHL from China, a total

ultra low cost pick and place?

Electronics Forum | Sat Jun 12 19:48:47 EDT 2010 | bootstrap

I like what you're doing. 20 years ago anyone, hobbyists and tiny garage-shop companies could create electronics devices just as sophisticated and cool as big corporations. Today, SMT has largely trashed the creativity (and competition) that existe

Cleaning Machine and Chemistry

Electronics Forum | Mon Feb 19 11:36:39 EST 2001 | billschreiber

Hello Mark, I wish it were that simple so I could direct you to a particular manufacturer and stencil cleaner model. Unfortunately, there are several issues complicating the process of cleaning all these applications in one machine. First and fore

AOI vs. XRay

Electronics Forum | Tue May 08 13:39:27 EDT 2001 | genny

Thank you for your response. I have been told that x-ray strength is finding solder volume and pattern root cause defects, and will catch a high % of them - opens, shorts, insufficient solder, and missing components(shape of solder on pad w/o lead i

How to calculate the ROI

Electronics Forum | Tue Jun 26 19:59:08 EDT 2001 | davef

They always tell you to calculate ROI, when they want to blow you off. Do a net search using - calculate ROI. Links to three pretty good descriptions on this are: http://www.dmreview.com/editorial/dmreview/print_action.cfm?EdID=2487 http://www.eval

Re: Solder surface tension

Electronics Forum | Sat Oct 09 09:07:48 EDT 1999 | Brian

| | | Can anyone tell me the formula/method to determine | | | the amount of weight that solder's surface tension can support. | | | (ie: Maximum weight of components soldered onto a bottom side | | | of a board during a top side reflow on a Paste/Pa

Re: Cylindrical diodes Missing during SMT process.

Electronics Forum | Tue Aug 24 15:10:14 EDT 1999 | Ian T

| | | | | Hello everyone, | | | | | We found many cylindrical diodes missing during SMT process. Could someone tell us how to prevent this problem? Is it effective to change the shape of stencil apture or reduce fan speed in reflow oven? Thanks in ad

Re: Cylindrical diodes Missing during SMT process.

Electronics Forum | Wed Aug 25 01:25:49 EDT 1999 | Gyver

| | | | | | Hello everyone, | | | | | | We found many cylindrical diodes missing during SMT process. Could someone tell us how to prevent this problem? Is it effective to change the shape of stencil apture or reduce fan speed in reflow oven? Thanks i

Re: Process Change

Electronics Forum | Wed Jun 23 11:47:48 EDT 1999 | Dave F

| In a month or so, we will be getting an in-line x-ray inspection machine. It will require that we solder our most comlicated side (normally top) first. This is opposite to our process now where we solder our passive (bottom) side first. We cann

Curious on how this thread developed

Electronics Forum | Wed Jun 23 14:23:14 EDT 1999 | Cunli Jia

Dave, Looks like you just replied to Ryan's original question, but the message itself shows that the two of you have been going back and forth. Did you copy from your email discussion? Just curious whether something is going wrong with the Forum.


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