Electronics Forum | Mon Mar 03 09:57:26 EST 2003 | msivigny
Hello markt, If you're only running at 85%, you've got some things to look into! First, it's good you know that you're operating at 85% with some measurables that help you determine that. Now, the easiest methodical way to improve productivity on SMT
Electronics Forum | Mon Mar 03 11:06:13 EST 2003 | msivigny
Hi floydl, I completely understand when it comes to data crunching after long hours of performing measurements, it's the last and most important arduous task in obtaining performance data. If a measurement and evaluation process that traditionally to
Electronics Forum | Wed Mar 05 11:45:04 EST 2003 | msivigny
Hello Yngwie, When we look at the technical benefits of using N2, you'll find that your customer is trying to get a better product. Now as we discuss just a few of the reasons to use N2, when O2 is present in the heating atmosphere it carries oxides
Electronics Forum | Thu Mar 06 18:48:34 EST 2003 | msivigny
Hello George, SPC can be time consuming but if you don't track or make recordings consistently then how do you measure your process performance and overall line quality?I'm sure your customer is asking because they want you to demonstrate that your p
Electronics Forum | Wed Mar 12 10:34:42 EST 2003 | Stephen
I want to be clear. You are talking about buying fully populated cards? And not just bare boards. Approach different CM's and compare contracts. You can pretty much get anything from "build from kit" where all the CM does is assembly, to complete s
Electronics Forum | Fri Mar 28 00:56:50 EST 2003 | iman
we have a issue of post-reflow oven (SMT) soldering defects of blowholes and pinholes. Any suggestions or knowledge on root cause is appreciated to be share? BACKGROUND : we DI water wash and oven bake the PCB bareboards at 90deg-C for 60mins, to r
Electronics Forum | Sat Mar 29 08:38:28 EST 2003 | davef
Iman When you talk about your profile, can we assume you're measuring it on the pads of LGA? Profile the solder paste reflow by placing a thermal couple under the component pad, similar to a BGA. On a slight tangent, as with soldering BGA, paste
Electronics Forum | Tue Apr 01 18:42:18 EST 2003 | rdr
Well, here is what I have found so far. I have removed the top of the BGA and found that the ball had detached from the package. Three balls were removed with the two adjacent balls pulling the pads off the board and stayed attached to the BGA while
Electronics Forum | Wed Apr 16 16:55:38 EDT 2003 | russ
Thanks for the info, Here is a couple more questions (and you thought you were done) What size are these caps /res? how thick is your stencil? what type of oven are you using? what is the finish of the board? Anyway, it seems like (from a distance)t
Electronics Forum | Fri Apr 18 13:47:19 EDT 2003 | davef
Brian What did we recommend? We just gave you a link so that you can see how to get your pictures on-line, so that we can see what�s going on. Anyhow, if we understand what you saying, [We're slow today. So, please be patient.] your situation is:
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