Electronics Forum: components (Page 1066 of 1140)

Where's the rush?

Electronics Forum | Thu Feb 23 18:50:09 EST 2006 | grantp

Hi, We are an OEM, so we deal with all stages of the pipeline from parts purchasing, to assembly to sales through our channel, and the biggest thing we have been worrying about is our inventory and bom conversions, as I don't want to be stuck with l

Necessity of ROSE in commercial quality processes

Electronics Forum | Mon Feb 27 17:08:15 EST 2006 | GS

3,5 ugr/cm2 NaCl) or power components, or Raw PCB. Nothing with the solder process or fluxes. Ion Chromatography analysis was necessary to help understanding of contamination origin. When occasionally we run TIC on a NC assembled PBA (Paste ROL0 or

Question on Thermal Overstress on BGA Balls During Rework

Electronics Forum | Fri Mar 17 16:58:52 EST 2006 | mikecollier

We are currently struggling with a particularly difficult component selection form our designers. This is a custom BGA, 592 balls, metal cover with a very large bead of adhesive using to retain the cover. We have had significant fallout (greater th

Typical SMT Machine changeover times?

Electronics Forum | Wed Mar 29 03:40:06 EST 2006 | Frank

The Juki 2060 can have both front and rear trolleys and you do not loose any feeder locations. My question was why can't the Assembleon put trolley on the rear? I recently visited a friend at a company that used a lot of Assembleon and compared run

Flux Residues In Lead Free Wave Soldering Process

Electronics Forum | Tue Mar 28 11:17:19 EST 2006 | smartasp

Thanks for the input Guys Yeah the not so knowledgable customer does not like to residues for cosmetic resons. The flux is for lead free process, of the no clean and water soluable type. We have explained to him that technically the residues do not

Double Sided Reflow - Low Melting Point Solders

Electronics Forum | Mon Apr 03 01:35:31 EDT 2006 | darby

I have a less than perfectly designed pcb requiring double sided lead free reflow. Several components from either side will detatch using the standard process. If I was using Sn63Pb37 I would just dispense some adhesive after paste and cure at the r

BGA Rework

Electronics Forum | Fri Apr 21 23:17:29 EDT 2006 | SD

Well, my first thought is that you need to consider lead-free rework. Depending on the alloy, some stations may not be able to reach the correct temperature. The best stations I have seen have a prism & shows both the pads and the BGA on a single v

Seeking very low volume production reflow oven

Electronics Forum | Wed Apr 26 12:38:33 EDT 2006 | TMC

I would suggest you do the following: get a sample / scrap board that you will be reflowing, attach thermocouples at various locations on the board, send the board to APS or whomever. Ask them to run a profile based on your solder pastes manufactur

Couple interesting articles on lead-free

Electronics Forum | Tue May 02 16:21:05 EDT 2006 | patrickbruneel

Grant, I personally disagree that lead-free can't be reversed. The reason it went that far is because lead has a bad reputation (lead in gas and in paint)and was probably assumed by the European green politicians as equally bad in solders. When they

Solder Bridging on Nexlev Connector

Electronics Forum | Tue May 09 22:57:58 EDT 2006 | davef

The NexLev connector is built in a stripline construction, providing a continuous ground plane for each signal contact. The connectors come as tenrow connectors with 100, 200, or 300 positions at possible stacking heights from 10 mm to 30 mm. Technic


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