Electronics Forum | Wed May 06 13:10:56 EDT 1998 | ZULFIQAR H. RIZVI
Dear Freinds, DOES ANY ONE OF YOU WILL BE KIND ENOUGH TO GIVE SOME INPUT ON DOUBLE SIDE REFLOW OF COMPONENTS WHAT ABOUT BOTTOM SIDE COMPONENT HOLDING DURING 2ND SIDE REFLOW? ANY IDEA OTHER THAN USING SLDERPASTE WITH OFFSET MELTING POINT, EPOXY DISPEN
Electronics Forum | Sat May 09 11:57:01 EDT 1998 | Bob Willis
How about checking out the Reports on Double Sided Reflow and Pin IN hole Reflow from the SMTA head office. They are both available now so give the SMTA a call !!!! | Dear Freinds, | DOES ANY ONE OF YOU WILL BE KIND ENOUGH TO GIVE SOME INPUT ON DOUBL
Electronics Forum | Wed May 06 13:44:58 EDT 1998 | Chrys
| Dear Freinds, | DOES ANY ONE OF YOU WILL BE KIND ENOUGH TO GIVE SOME INPUT ON DOUBLE SIDE REFLOW OF COMPONENTS WHAT ABOUT BOTTOM SIDE COMPONENT HOLDING DURING 2ND SIDE REFLOW? ANY IDEA OTHER THAN USING SLDERPASTE WITH OFFSET MELTING POINT, EPOXY DI
Electronics Forum | Thu Aug 30 21:57:26 EDT 2001 | Franky
I have problem about glue printing measurement ,anybody has process of glue printing . How do you measure? as I know "push test" is the method for testing the strength of connection of component and board but I don't have specification of testing for
Electronics Forum | Fri Sep 07 07:39:11 EDT 2001 | caldon
Can you confirm the components are being picked up from the feeders? If the Feeder table calibration is incorrect the components could be picked up off from the begining. This would result in 1) nozzle barely picking up the part and as the head moves
Electronics Forum | Tue Jan 08 17:26:28 EST 2002 | davef
Our standard is: Accept and/or reject decisions must be based on applicable documentation. As an element of this, the marking on the part must identify the part positively. If the marking on the part does not identify the part positively, the ins
Electronics Forum | Wed Feb 20 09:38:47 EST 2002 | davef
Search the fine SMTnet Archives on � Sn62 � 62Sn � 2% Ag � 2% silver � 2Ag � etc re: "Do you have to use Tin/Lead/Silver paste only if the components are made from Tin/Lead/Silver ?" No Several points are: * Component leads with silver in the sol
Electronics Forum | Fri May 10 05:38:19 EDT 2002 | ianchan
Hi Mates, Need everyone's help on a component datasheet search. Have a Maxim P/N: 3286C, 3296C, Land Grid Array (LGA) type of component. Need to find info on thermal capability of this LGA package, specific question : how many reflow Oven cycles c
Electronics Forum | Mon Aug 19 20:45:31 EDT 2002 | davef
Bob Willis and Phil Zarrow have had a running commentary on the ability of reflowed solder to hold components on the bottom side during reflow. You can find references to their component weight to pad area rations in the fine SMTnet Archives. The
Electronics Forum | Tue Nov 19 14:58:26 EST 2002 | caldon
HEy all- We are in need of components. Chips, ICs, QFPs, BGA, SOIC, and so on. Does not matter the configuration, style, package. Stick, Tape, Matrix, Tray,Bulk. Typically should be "virgin" not used. And we would like these for a low price...FREE.
