Electronics Forum | Tue Sep 23 23:19:34 EDT 2003 | RLW
If you have a board that you've run several times, now you run it and like before all settings are the same, but now you have 0603's randomly skewed or an inch or so away from their intended pad (as if popped up in the air), or an occasional 7343 cap
Electronics Forum | Tue Jan 09 17:37:00 EST 2018 | tozitom
The truth is that TH will give you better > mechanical stability. If it is a part where you > risk strip off the pads of SMT connector, don't > make this transition to SMT. If it is a one time > cable plug there and there will be not too much >
Electronics Forum | Wed Jan 10 04:33:05 EST 2018 | spoiltforchoice
Simulating with what? In developed countries manual labour is expensive but is also still the most common solution to fitting though hole parts, even if the board are then wave-soldered. Mixing SMT and THT on what sounds like a very simple product wi
Electronics Forum | Thu Jun 22 11:42:29 EDT 2000 | Chrys Shea
Sal, Silly question: Were the parts skewed before they went into the oven? I've chased down a few similar reflow problems in my lifetime, only to find out it was a pick and place problem. Wrong nozzle size, bad nozzle, feeder not advancing all
Electronics Forum | Tue Sep 14 10:25:37 EDT 1999 | Earl Moon
| I'm hoping to use 0201 caps and resistors in a new design but so far have only found one company who makes such small devices (Murato). | | Can anyone direct me to any other supplier? | | Are there any particular problems associated with using s
Electronics Forum | Tue Nov 15 08:41:04 EST 2005 | Joe Wesley
Since I asked the question - here is what we have identified. We are doing what we call a jump score. Routing critical areas with v-score in non-critical areas. We have optimized the v-score depth as much as we can without having separation through h
Electronics Forum | Wed Sep 15 19:01:39 EDT 1999 | DGrenier
| | I'm hoping to use 0201 caps and resistors in a new design but so far have only found one company who makes such small devices (Murato). | | | | Can anyone direct me to any other supplier? | | | | Are there any particular problems associated wi
Electronics Forum | Tue Jun 03 13:23:02 EDT 2014 | taiji
Also, for MSL 1 and 2, non sealed components, what should be the min/max storing temperatures?
Electronics Forum | Wed Jun 24 18:50:55 EDT 1998 | John Silvestri
Has anyone seen a problem with solder under chip components, in-between the glue and the component or in-between the mask and the component? We seen both. What could be causing this? This has only been detected on one of our products. All the rest w
Electronics Forum | Wed May 28 05:31:17 EDT 2003 | dougie
Hi, Can someone please give me an IPC standard number or similar for decal design when wave soldering SMT components on the underside of a board. Hopefully a document exists detailing design rules, the components ideal attitude to the wave, suitabil
