Electronics Forum | Fri Nov 19 13:47:03 EST 2010 | cyber_wolf
We have witnessed capacitors falling off in wave due to mold release being present on the component.
Electronics Forum | Thu Dec 16 15:06:32 EST 2010 | rway
I would go with AOI. Reasons are: --AOIs are faster --They have more coverage. Given, you cannot test the value of components, but the AOI will ensure that all resistors are correct, orientation of ICs are proper and components are present on the
Electronics Forum | Mon Nov 29 16:25:23 EST 2010 | davef
Do you mean determining machine capability of the placer by running a glass board with glass slug components?
Electronics Forum | Mon Jan 10 12:54:48 EST 2011 | ghenning
http://www.practicalcomponents.com/
Electronics Forum | Mon Jan 17 14:50:26 EST 2011 | tombstonesmt
Any suggestions? How far can the cut be from the component to sum up the question.
Electronics Forum | Fri Mar 18 16:25:07 EDT 2011 | bradbriggs
Thanks I will check it out.
Electronics Forum | Fri May 20 09:50:10 EDT 2011 | blnorman
Have you checked for ESD?
Electronics Forum | Mon Jun 06 11:11:44 EDT 2011 | frcdave
Melanie, Given the examples of the solder joints in this and surrounding components, I would believe that there is no solder present.
Electronics Forum | Tue Jun 07 10:38:34 EDT 2011 | davef
Boots: Here's several methods for guessing at the amount of solder on your connection: * First, 'Down & Dirty' ** Assume that the solder is flat, which is reasonable since it's 'flattened' by the component package ** Assume 100% paste transfer from t
Electronics Forum | Tue Jun 14 10:02:11 EDT 2011 | travishemen
Thats .088" from component edge to pcb edge.
