Electronics Forum | Thu Feb 24 11:11:25 EST 2000 | Russ
I have seen this before, our problem was palladium termination of this component. We could not change suppliers so we use a "reverse homeplate" stencil design to put the majority of paste directly underneath the solder terminations of the component
Electronics Forum | Mon Feb 21 22:36:19 EST 2000 | Dave F
Cedric: I know you said "5KE36CA." Motorola, Fairchild, and some others make a zener transient suppressor 1.5KExxCA. The CA suffix makes it bidirectional. Actually, Motorola is no longer in the business. On Semiconductor (www.onsemi.com) sells t
Electronics Forum | Sat Jan 20 20:54:03 EST 2001 | fmonette
Dear Mike, As you might have noticed from the labels on the dry bags, the maximum floor life is specified by the component manufacturer and it can range from 1 year (level 2) down to a few hours after mandatory bake (level 6). This limit is based o
Electronics Forum | Tue Feb 06 10:55:58 EST 2001 | pjc
Larry, Our specification is 0.075% for our Fuji CP3 and IP2 machines. At or above that figure the Maintenance Dept. has to get to work. We typically see 0.03% to 0.05% on average. The Fuji machines are all vision centering. We have found feeders are
Electronics Forum | Fri Feb 09 20:41:02 EST 2001 | CAL
We like our AOI from Cyber Optics but only use it for process prove out. I would rather have a solder paste inspection system in line. The cost of AOI is killer. A new process is to embed a UV signature between the components pads and when a componen
Electronics Forum | Thu Mar 01 16:58:05 EST 2001 | davef
Last time we looked at this, JEDEC carefully designated the dimensions of the carriers, but "neglected" to define the component orientation with the carrier. Go to http://www.jedec.org/download/, search for JEP95 JEDEC REGISTERED AND STANDARD OUTL
Electronics Forum | Fri Mar 09 08:25:13 EST 2001 | CAL
We have seen some problems with component end cap solder terminations not being symetrical. i.e. If one end on the cap has a larger solder ternination this sometimes is enough surface area during reflow to lift the opposite side of the component. We
Electronics Forum | Thu Apr 12 00:43:38 EDT 2001 | zam_bri
Can anybody gimme some input on the problem I faced currently on 0402 Chip Resistor. At pre-reflow the component are placed nicely but at post reflow, we found the Resistor stands sideway ( both termination, the pad and componant are in contact, fun
Electronics Forum | Wed Jun 13 17:15:48 EDT 2001 | medernach
Yes, I've seen it recently and it's most likely a component problem. A cap is essentially a sandwich comprised of multiple layers. the layers are either wet film or dry film. The end terminals may either be hot soldered or sputtered so there are a
Electronics Forum | Wed Aug 01 10:28:11 EDT 2001 | btaylor
We have this problem with our High Temp. solder lines. Tombstoning is actually the term used in our facility. We found that the component termination width was a main contributor also profile ramp rates. Visual inspection will catch most of these rej
