Electronics Forum | Tue Jul 14 13:45:04 EDT 2009 | christian01976
Hello! You could check your pick an mount vacuum, too. You can do it in COMPONENT INFO with the ADJUST ASSISTANT (F6). Then PICK UP COMPONENT. If you don´t know how to read the grafic that is shown then just push F1 for HELP. What size do the TANT h
Electronics Forum | Sat Aug 15 09:34:06 EDT 2009 | davef
It would be nice, save you money, improve yield, improve reliability, etc. if your reflow process was more effective. It sounds like you're not getting the part hot enough during reflow soldering. Tell us about: * Measured temperature on this bluetoo
Electronics Forum | Wed Aug 19 01:00:13 EDT 2009 | sergey2007
Hi! Thanks to everyone! Josh, I don't think it could be something wrong with the mechanics, as just one component was rotated. Anyway, we will check the mechanical parts of the oven. LarryD, thank you for the advice. But what is the physics of the
Electronics Forum | Thu Sep 03 11:38:28 EDT 2009 | dyoungquist
I'd be more concerned with the pcb itself then I > would be with standard SMT components. Are you > using a PCB with a high Tg? (170 degrees C or > greater) The circuit board material is NP-170B (Nan Ya Plastics Corporation). It has a Tg of 170
Electronics Forum | Thu Oct 08 08:15:39 EDT 2009 | kpm135
We've used both 1A33 urethane and 1B31 acrylic coating on our SMT assemblies with great success for many many years. This is with components of all shapes and sizes including a 9 ball micro-BGA. We apply the coating in every way imaginable and we hav
Electronics Forum | Fri Oct 23 09:48:40 EDT 2009 | allwave
Hi Guys, > > can anyone recommend a good and > reliable prep machine? that can also perform > trimming and forming for axial and radial > components. our plant is located in > philippines. > > thanks in advance kircchoffs. We use Hepco Mac
Electronics Forum | Tue Nov 03 09:32:57 EST 2009 | valeo
Hi all, I'm today looking for adhesive specifications on SMT process (by printing). The Glue printing process is new in my company, and I need info, please!!! Do you know specifications about Shear component value with gluing process (on component
Electronics Forum | Wed Nov 04 03:33:04 EST 2009 | valeo
Hi Davef, I have already checked the SMTnet archives but unfortunetly I didn't find answers regarding mechanical behviour specifications of component glued on substrat. This king of soldering process is new for us. For example, the specification f
Electronics Forum | Thu Nov 12 12:05:06 EST 2009 | valeo
Up! Thanks anyway for your answer Lynn. But I'm still in the issue regarding the assembly of passive components on substrat with conductive adhesive. We hardly reach the minimum specifications of shear strengh for each component we use (1206, 0805
Electronics Forum | Thu Nov 05 16:38:45 EST 2009 | rdoss
I don't recall where the puff off setting is either, but i know there is one. Find it and use that along with extending your pressing time. This will increase the time in which the nozzle holds the component in the solder. That, along with the puf
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