Electronics Forum | Thu Mar 13 14:51:23 EST 2003 | juan_ruiz
A good standard could be 99.7% of Pick up reliability in terms of machine performance, but you should take care of the cost of the parts that you are scraping.
Electronics Forum | Thu Mar 13 19:11:03 EST 2003 | Wes
Does a third solder reflow compromise component and solder reliability? We find that the only way to rework a particular BGA without warpage is to reflow the entire board.
Electronics Forum | Wed Mar 19 16:12:51 EST 2003 | Sudhir
I would suggest to have a rework station to rework only a single component we are having a genrad rework station to do these things
Electronics Forum | Wed Mar 19 21:01:49 EST 2003 | Rob
I would suggest creating a special reflow profile, heating the board up to 130C about 50 c below eutectic point (183C). Then applying heat to only the BGA, this will prevent thermal shock to surrounding components.
Electronics Forum | Wed Mar 26 16:05:13 EST 2003 | davef
Ren�: Look here to get started with you efforts: http://developer.intel.com/design/Quality/component/rework.htm
Electronics Forum | Thu Apr 03 18:10:08 EST 2003 | Print Master
0402 Adhesive printing is possible with thicker stencils in order to allow mixed component technology. We have successfully printed 0402's with a 0.008" thick SS foil. Total material release is not achievable at this thickness, but not required u
Electronics Forum | Thu Apr 10 19:19:01 EDT 2003 | stevemoore
Are you gluing the parts to the board? We had a similar situation where the glue beneath the component would add a 'fulcrum' point to the center of the device and when the board flexed the part would fracture.
Electronics Forum | Mon Apr 14 10:50:43 EDT 2003 | emeto
Pete I'm not very informed about it but from the things I red today - 2D inspection : solder component solder joints x-ray and what ever type exsist.
Electronics Forum | Tue Apr 15 08:38:23 EDT 2003 | pjc
Don't have any specific links to papers and articles. Try searching on the IPC.org (plus APEX show http://www.goapex.org) and SMTA.org web sites. Any papers and articles on the process from equipment mfg.'s should be taken with a grain of salt. Sold
Electronics Forum | Fri Apr 25 15:01:29 EDT 2003 | swagner
Go to http://www.gsilumonics.com we use several of their systems for both paste and component inspection and week in and week out maintain a 99.85%+ first pass yield on a no post reflow repair line.
