Electronics Forum | Tue Aug 19 09:23:18 EDT 2003 | caldon
FUJI DUDE- You can purchase a Kit from IPC for verifying machine acceptability. IPC-9850 full kit with Components and boards, and such will set you back around $26,250 (member price). Just the glass board alone will cost you $3,800 (member Price).Thi
Electronics Forum | Wed Aug 27 21:03:03 EDT 2003 | davef
What does TDK [ http://www.component.tdk.com/fa/factoryautomation.html ] say?
Electronics Forum | Thu Sep 04 06:50:20 EDT 2003 | welsh
With so much Miniaturisation over the last ten years,one kind of non-stop breakthough will be the size of components placed so accuratly and in such large volumes. And the ongoing problems arising from everything getting smaller. What about Tracebil
Electronics Forum | Wed Sep 24 16:02:05 EDT 2003 | davef
Sounds like an ideal method for damaging fragile solder connections, eh? Is your customer paying extra for this 'inspection'?
Electronics Forum | Mon Sep 22 23:27:09 EDT 2003 | severs
By "hacking" do you mean altering the performance of the board or something else? This reminds me of something I saw a while back. Better termed counterfeiting than hacking, it may have some relevance to what your friend is trying to do. The probl
Electronics Forum | Mon Oct 13 13:49:29 EDT 2003 | mrmaint
Does anyone know of a standard stencil thickness for BGA'S. We currently use 4 to 5 mil stencils depending on component mix. Is an aperature reduction required for BGA'S. If so what percentage. Any help would be greatly appreciated. Thanks MRMAINT
Electronics Forum | Mon Oct 13 19:04:47 EDT 2003 | davef
Aperture size should vary with the component [pitch]. That size should be the same a the pad size. So, generally pinching is not required. Indium discusses BGA apertures on their site [ http://www.indium.com ]
Electronics Forum | Tue Nov 04 10:21:40 EST 2003 | blnorman
One of the requirements for our components and PCBs is fluid compatibility. They are tested by a 30 second immersion in the applicable solvent/cleaner/fluid, then they are tested for functionality and degradation.
Electronics Forum | Thu Nov 13 20:48:04 EST 2003 | davef
There a number of studies like this published by component fabricators. Many can be found on the net. For instance: http://www.amd.com/us-en/assets/content_type/DownloadableAssets/Pb-free_Board-level_reliability_study.pdf
Electronics Forum | Sat Nov 22 08:14:47 EST 2003 | davef
When the pads on the board are too large, the component tends to swim. This skewing can be a BIG problem with connectors, eh?
