Electronics Forum | Mon Nov 21 03:52:23 EST 2005 | Slaine
Hi Each homogenous material is considered individually not the component itself. So in this case the glass may be exempt(Im not sure it should be exempt?) but the solder for the leads wont be.
Electronics Forum | Fri Nov 18 08:46:55 EST 2005 | leztor
Our manufacturing line We should AOI before and operator appearance for confirm all parts because so many small component (0603,1005)
Electronics Forum | Fri Nov 18 08:21:28 EST 2005 | stefwitt
In order to burn (old fashioned) E-PROM, I can't always verify the vendor of an IC on the print. The logo is very likely the initial letter of the manufacturer, but sometimes it requires imagination to read the letter. Could somebody guide me to a li
Electronics Forum | Fri Nov 18 17:19:16 EST 2005 | Frank
Head to your local pharmacy dept and get some of those weekly medication holders/dispensers. They usually have 7 or more individually pop-top compartments for your daily meds.
Electronics Forum | Fri Nov 25 09:01:24 EST 2005 | Amol
cookson has something they call "cool caps" that reduces the delta T across the component top surface, something you might wanna explore to reduce the delta T even further....FYI, I am not associated with cookson in any way
Electronics Forum | Fri Dec 16 21:16:38 EST 2005 | Frank
The RoHS legislation says that it possible to have an exception from lead. That means that You are allowed to have Pb in the solder joint! While the component and the pcb must be RoHS compliant! Isn't that fun?
Electronics Forum | Sat Dec 17 08:07:06 EST 2005 | grantp
Hi, What worries me is that a lot of people speak about what they have heard, but there is no firm facts on exactly what the situation is. I did a seminar on lead free a while ago, and was told that going lead free on the components while running l
Electronics Forum | Thu Dec 01 14:42:57 EST 2005 | Amol Kane
my first thought was that too, but all the other components on tha board have reflowed properly. I have tow test boards, one with Imm Sn and other with Imm AG. on both these boards only the QFP has this solder phenemenon
Electronics Forum | Mon Dec 05 09:31:19 EST 2005 | whippingpost
Not all but some were tested O.K before the failure. What are some of the other reasons for ball separation from the component body besides mechanical stress?
Electronics Forum | Tue Dec 06 05:40:12 EST 2005 | ajay
we also faced similar problem in fuji cp643. addition to your suggestion - mainly in program PCB thickness, component height checked & set correctly , then problem solved.
