Electronics Forum | Mon Sep 25 09:42:51 EDT 2006 | slthomas
It sounds like it's just failing the laser align step. Try changing the align type for the part to "2" and see if it places it. If it's failing the laser align and you have valid part dimensions I can't help much but you might consider opening up th
Electronics Forum | Mon Jul 16 09:53:36 EDT 2007 | ed_faranda
Yes, you can use lead-free parts in a leaded process. And the other is true as well, no-lead free parts in a leaded process. BUT, you should not use leaded parts through a non-lead wave solder process and of course, your board will not be RoSH.
Electronics Forum | Mon Jul 16 10:26:54 EDT 2007 | davef
Ed: We agree with you that leadfree parts can be used with leaded paste. We disagree that lead part can be used with leadfree paste. Here is link to a previous discussion here on SMTnet on the topic: http://www.smtnet.com/forums/Index.cfm?CFApp=1&M
Electronics Forum | Fri Jul 20 13:18:54 EDT 2007 | samir
You know the old addage, "Those who can't do teach." From my own experience with some of these "well-known consultants", they know lots of textbook theory, and..they speak in buzzwords and cliches (just like their magazine articles). I'm not saying
Electronics Forum | Mon Aug 20 10:03:48 EDT 2007 | slthomas
Wow. Never have, never would, but that doesn't mean it couldn't be done. Mostly it just seems impossible to design a carrier clip that could hold both well...more likely it would hold one well and the other poorly, or both poorly. Anyway, is there
Electronics Forum | Fri Jan 22 13:22:18 EST 2021 | davidhillman
Hi Graham - brite acid tin gets it "shiny" appearance due to codeposited organic material in the tin plating. The codeposited materials volatilize during the soldering process causing a ton of voids. Brite acid tin plating should not be used as a sol
Electronics Forum | Wed Jan 11 18:59:22 EST 2023 | agrivon
At SMT assembly level, the main HiP mitigation actions to consider should be increasing the stencil thickness/aperture sizes (typically in the 4 corners where warpage is maximal) + possibly reducing the reflow peak temperature as probably indicated i
Electronics Forum | Sun Oct 31 17:33:15 EST 2004 | Ian
GerberGrab does exactly this, and it's low cost, and you can use it for a month for free. It is a sophisticated but easy to use reverse engineering tool which will automatically generate top / bottom BOMs with placement and rotation after teaching of
Electronics Forum | Tue Nov 29 12:16:29 EST 2005 | Inds
MKS, You do not need to reach a temp of 245C to form a joint and surely not for 0603s. Since you are using such a high temp your flux is getting dried out.. Also if you are going to reach a peak of 245C on a brd that has Sn/Pb compt and Pb-free.. yo
Electronics Forum | Fri Sep 22 15:35:14 EDT 2006 | lheiss
Hello all, Finally ready to run my first 14 up array and the machine picks up the part moves to the placement location, them moves to home and drops the part. The Z axis never moves. I do get a "run error 1" at about the 4th placement (if it was a
