Electronics Forum: components (Page 466 of 1140)

Glue

Electronics Forum | Thu Sep 24 17:36:12 EDT 2009 | davef

Both of the articles talk about pockets cut in the contact side of the stencil that correspond to components [or PTH leads] that would allow PTH first, glue second, and finally second-side SMT placement.

Component rework quantity in PCB

Electronics Forum | Tue Sep 22 23:53:01 EDT 2009 | rohitfast

Thnaks Davef..... Next time i will take for this. Actually i have tried but not found any exact answer for the same.

TQFN Solder Issues (56 contact) ZF

Electronics Forum | Fri Oct 23 16:54:02 EDT 2009 | pnguyvu

FOR YOUR NEXT RUN CONTACT STEVE @ USA STENCILS INC, HE WILL MAKE ONE SAMPLE FOR YOU - THEIR TEAM HAVE SOLID EXPERIENCE IN STENCIL DESIGN ESPECIALLY PCB WITH CRITICAL COMPONENT. HIS EMAIL IS STEVE@USASTENCILS.COM GOOD LUCK!

Prep Machines

Electronics Forum | Fri Oct 23 09:05:04 EDT 2009 | kircchoffs

Hi Guys, can anyone recommend a good and reliable prep machine? that can also perform trimming and forming for axial and radial components. our plant is located in philippines. thanks in advance

Pick & Place File Formats

Electronics Forum | Tue Nov 03 01:11:51 EST 2009 | dilogic

Almost every machine can import plain ASCII files, internal formats vary a lot and usually are in some kind of binary format. My suggestion is to generate plain ASCII file with at minimum 5 fields : X, Y, theta, RefDes and component type. - Deni

Harwin PC/104 Connectors

Electronics Forum | Fri Nov 06 05:44:03 EST 2009 | 15009

Add that to boards with solid solder deposit (ssd) pads and you have a perfect assembly. Teka components work great mk

"cut tape" tray

Electronics Forum | Tue Nov 17 08:09:28 EST 2009 | kpm135

Standard component tray for what Pick and Place machine. I know of different ones made for different machines but each machine has different feeders and handles it a little bit differently.

Bubbles on solder joint(after conformal coating curing)

Electronics Forum | Sun Nov 22 18:40:47 EST 2009 | 89jeong

Hi The bubble shows only around component body after ir reflow. I think bubble means that there is a moisture. How do you dry the PCB(?) before IR reflow? Thanks Ju-young.

BOTTOM SIDE CHIP COMP FALLEN OFF IN WAVE SOLDER

Electronics Forum | Sat Dec 05 09:17:24 EST 2009 | nagesh

Solder paste & reflow the Bottom side.Use wave solder pallet to isolate the soldered components.

Temperature Profiling

Electronics Forum | Fri Dec 11 07:02:51 EST 2009 | Jeff

I use aluminum tape. Attach the thermocouple to the solder joint of a component. Use tape to hold down the wires so your thermocouple doesn't break free. Go to youtube and search "oven profile". There are some great "how to" videos there to help yo


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