Electronics Forum: components (Page 686 of 1140)

drill hole overlapped? is it acceptable ?

Electronics Forum | Fri Apr 19 13:47:00 EDT 2019 | davef

It's a terrible idea. Through holes should be drilled in the exact center of a pad +/-. Have the two holes go out back and settle this. Whichever hole returns, that hole get to keep the pad. The other hole needs to get its own pad. End of story. Th

QFN standoff, industry standard

Electronics Forum | Wed Mar 27 07:01:26 EDT 2019 | charliedci

200uM seems high. I say this because typically our solder stencils in this application are between 80uM and 100uM thick which would leave the component height less than that after reflow. However if your not experiencing any shorting between pads I w

Thermal Interface Material

Electronics Forum | Fri Mar 29 08:27:46 EDT 2019 | SMTA-williams

Can anyone help understanding the function of the oil in a bi-components Thermal Interface Material ? After a while, when the material is stored, the oil comes up in the surface : shall we remove it ? shall we re-integrate it into the TIM ? what if w

Tray table set up on Tray Wagon Mydata MY12

Electronics Forum | Tue Apr 09 21:57:42 EDT 2019 | alexvolovich

If you were able to do a first/last part, then your tray wagon is set-up. You need to go to Tray Types and program the tray that will match the piece of tape you have. Then you should be able to add your component to the tray wagon.

BGA rework clearance

Electronics Forum | Thu Apr 25 17:17:44 EDT 2019 | spitkis2

Years ago it was common to see 2-3mm keep out areas around BGAs. Now with boards being so densely populated there are no clearance minimums. Regardless if the machine is using convection or IR heating, parts can be reworked without affecting adjace

Component missing in siplace mounter

Electronics Forum | Tue May 07 12:50:17 EDT 2019 | sankarseptember

Thanks for the response Thomas..You are correct I got solder paste on both edge on the nozzle type 4007. But it uses for nearly 30 types of part number ..and also I will get missing without any issues in nozzle..I am unable to find the trace in that.

Profiling for Pb-free HASL

Electronics Forum | Thu Jun 06 15:18:56 EDT 2019 | gregoryyork

Honestly, If I ever have an SMT problem it's when a profile is at 230-235C. We encourage minimum 240C and typically 245-250C. Many components call for 260C. Some Paste manufacturers advocated 230C in the early years of Lead Free and it was a disaster

how to control warpage on panelized pcb during reflow process

Electronics Forum | Mon May 13 06:38:41 EDT 2019 | relaycz

You need to give us a little more information. 1. What is the size of your panel? 2. Are there any heavy components? 3. What is the thickness of your board panel? 4. What kind of oven are you using? 5. Is it only a recent problem or ongoing one?

Cracked Capacitors - Analysis

Electronics Forum | Wed May 22 10:14:08 EDT 2019 | emeto

Matt, we did the study and YES perpendicular to the V-score is the worst case scenario. We did a cross section and confirmed component is cracked. If you don't have power over PCB design, the easiest way is to change board panelization or even order

ELECTRICAL TEST MYDATA MY12

Electronics Forum | Thu Jun 06 03:29:21 EDT 2019 | chafik

Thank you for you comment, but i didn't get your point, because my problem is that i don't have this option, but we can activate this option by doing a passpinlink ( kind of strap between two components on the main board ), but i don't know exactly w


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