Electronics Forum | Fri Apr 08 16:26:36 EDT 2005 | Grant
Hi, It seems weird that an automated pick and place machine at a board shop would not be up to NASA standards, but placing the components by hand would be. However most SMT will self center a bit, so if your close enough, you should be ok. You rea
Electronics Forum | Mon May 09 12:26:17 EDT 2005 | stepheniii
If followed, would the following strategy meet the requirements of IPC/JEDEC J-STD-033A; All MSD components are either exposed for less than 1/2 an hour or final reflowed within 12 hours of opening. What I mean by exposed is any time the parts are n
Electronics Forum | Thu Jun 29 23:39:25 EDT 2006 | grantp
Hi, Oh, never noticed this old comment, but now the threads been revived i can comment. I have actually owned three MYDATA machines over the duration of the last 6 years, and they all had accuracy problems. It depends on what your doing, but we got
Electronics Forum | Tue Jun 07 16:19:58 EDT 2005 | davef
Q1) How to identify on good or bad ICs lead that could contribute to dewetting? A1) Distinguish between good or bad IC that could contribute to dewetting by testing for solderability, according to J-STD-002. Q2) What actions that must be taken in fa
Electronics Forum | Mon Jun 27 14:20:57 EDT 2005 | Bob R.
If you visually inspect the solder joints of the first dozen or so boards with the Pb free parts and you're meeting workmanship standards then I wouldn't worry about it. When we started getting the first barrage of Pb free parts a couple years ago w
Electronics Forum | Sat Oct 08 00:49:59 EDT 2005 | Mika
We do the following things: 1.) RoHS PCB:s is marked with a code. This is to identify that the PCB:s itself are RoHS compliant. 2.) If it is a true RoHS PCBA; we put a printed label with a green "texture" on the PCBA. 3.) If it is a mixed PB free/PB;
Electronics Forum | Tue Dec 27 10:11:50 EST 2005 | pjc
Here's a few mfrs. to look at. http://www.vjelectronix.com/vjebeta/index.asp http://www.glenbrooktech.com/advantage.htm http://www.lixi.com/product_workstation.htm http://www.focalspot.com/ http://www.microfocus-x-ray.com/frameset.php?PageN
Electronics Forum | Thu May 18 08:31:28 EDT 2006 | marc
Hi James Short answer... yes... long answer...impingement velocity is excellent for heat transfer but it also is a higher risk of moving components. Variable speed blowers allow you to reduce the speed / impingment and more than likly your compone
Electronics Forum | Sun May 21 09:38:25 EDT 2006 | davef
Epoxy Removal and IC Delidding [Hardware Hacking: Have Fun While Voiding Your Warranty, Chapter 14] Encapsulation of critical components using epoxy or other adhesives is commonly done to prevent tampering and device access (the microprocessor shown
Electronics Forum | Thu Jun 29 13:27:20 EDT 2006 | pjc
Verify that the CEMs machines and processes are capable of assembling the technology of your boards- smallest components, largest components, finest pitch, flex circuits, etc� Are their core competences aligned with your requirements- assembly only,
