Electronics Forum | Thu Oct 19 12:00:55 EDT 2006 | sliebl
Can anyone tell me if they are aware of any pick and place machines that can use 'randomly placed' local fiducials? Now, let me explain... Our machines (Contact 3S, and 3AV machines) can use local fiducials in several ways. We can use a single center
Electronics Forum | Sat Oct 21 21:39:43 EDT 2006 | Mats
"Surface Mount Techniques has approximately 98 percent of the world market share of large Panel Stencil Printers". It sounds a little bit strange to me, especially since I work for one of the companys listed in their advertisement and it is definite
Electronics Forum | Tue Oct 31 09:43:06 EST 2006 | SWAG
Yes, this board is approx. 3" x 17" x .062"T with large areas of ground planes. However, the delam. does not seem to be confined to the plane. We also see it around component pads and fiducials. Generally speaking, it could be said that the first
Electronics Forum | Fri Nov 17 07:58:06 EST 2006 | markb
SWAG - I also forgot to mention a few things. Our delmaination was always between the large copper plane and the laminate. It is a multi-layered board, so even when the delamination appeared around components (through visual inspection), cross-sect
Electronics Forum | Fri Oct 27 11:44:05 EDT 2006 | billyd
Hi guys. I'm hoping maybe some of you can help me with some information today. I'm looking to find out "ballpark" how much a decent board washer would set me back. The one I currently have just isn't doing the job the way I want it. It seems to have
Electronics Forum | Mon Oct 30 20:24:35 EST 2006 | davef
As we understand it, you: * Get some nice BGA from your supplier * Find BGA to be packaged properly * Bake the BGA for 24 hours at [what temperature?] to reduce the potntial for damaging moisture sensitive components during following processes * Remo
Electronics Forum | Sun Oct 29 22:47:03 EST 2006 | LMPH
We are going to start doing rework of Lead Free BGA's. Have always used flux for SN/Pb boards/BGA's with good results. Can flux be used fro lead free as well? Boards were originally assembled using lead free paste and components. Hence, the BGA w
Electronics Forum | Wed Nov 01 08:55:05 EST 2006 | russ
See if the solder is leaving the pad(s) and is wicking up the component. This is long shot but I have seen something similar to this possibly in a wave process. We had a very thin board and a very large QFP on top. During wave operation the solder
Electronics Forum | Mon Nov 13 10:02:52 EST 2006 | pforister
Bill, We only allow 3 boards to be printed in front of the pick and place equipment. It is important to keep the abandon time to a minimum. You did not mention the paste that you use. Do you use no-clean or water soluble? Do you use lead free?
Electronics Forum | Sun Nov 19 22:21:37 EST 2006 | KEN
When you say "SMD" I am assuming you are refering to a component. But in your description you mention these are some type of "boards". "flatness" or coplanarity is a function of the application and process. I think in your case your standards wo
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