Electronics Forum | Mon Aug 21 04:36:34 EDT 2006 | Rob
Yes, appropriate storage & component handling proceedures should be followed depending on the MSL (Moisture Sensitivity Level) class of the component. Some component suppliers are now marking the MSL class on the label, along with PBT (Peak Body
Electronics Forum | Fri Feb 09 01:41:46 EST 2007 | Muhammad Haris
CHECKS FIRST that your BGA doesn't tilt from pick & place machine. SECOND lead free paste have some problem that it solder the component whereever pick&place put the component while solder pastes having lead, put the component on its PCB pad like a
Electronics Forum | Tue Apr 03 08:53:07 EDT 2007 | namruht
Thanks for the help everyone. I think that the pattern instead of a leaded component is going to have the best results. Also I checked on the software update and there is not any component database differences between the newest and my current versio
Electronics Forum | Tue Apr 24 15:50:05 EDT 2007 | geb
Hi, I have a Universal GSM1 flex head. When it scans a resistor over the fixed camera, it shows a red box around the component and highlights the inside green if it recognises it. Around this is a larger blue box which I assume is its search area. I
Electronics Forum | Thu Nov 29 22:31:27 EST 2007 | shy
Hi Stephen, The component falling off is the component that had glue. the component witout glue is being covered by masking during wave. What is the meaning by populated the part and cure it? is it run with solder paste profile or glue profile or yo
Electronics Forum | Fri Nov 30 08:35:51 EST 2007 | stepheniii
We put glue on the bottom of the board that already has the topside SMT mounted. We populate the board. We put it through a cure profile. At this stage the topside components are soldered on. The bottom side components are glued on with NO solder on
Electronics Forum | Sun Aug 31 07:13:13 EDT 2008 | allan99
All that they are telling is important (variants in the process), what you can do in a fast way is: change the component for a new one (date of manufacture / other supply - if you have); change the component (test - same package but other specificati
Electronics Forum | Mon Jul 13 11:34:44 EDT 2009 | snsmt
thanks everyone! When we have a PCB to do, for one component, they usually give us an excess of 10 components! We are issued over 2,000 components. Does that sound reasonable? The problem is usually when the head picks up the component before it r
Electronics Forum | Thu Oct 27 15:49:06 EDT 2011 | davef
MachineHead: I'm not so clear on the definition of the problem. Is it: * Some components are picked, but others are not picked and remain in the pocket of the tape * All components are picked, some are placed, but others are not placed * Everything p
Electronics Forum | Thu Dec 08 01:17:35 EST 2011 | mk15
Hi, I look Pick & Mount and Mount action was NORMAL - OK. When the head pick component then stop outside lamp housing (fixed camera - recognition camera) and then discard component. It repeat 3x, and Error E2. When I do adjust assistant for componen
