Electronics Forum | Mon Jan 19 09:07:45 EST 2015 | cotinc01
We can offer several nozzles to assist with the placement of 0402/0201 components in the four-spindle head. We offer the 06MPF along with custom ceramic tipped nozzles. Most of our standard nozzles for this head type are less than $125.00 each. Chec
Electronics Forum | Fri Jan 30 00:41:04 EST 2015 | neeraj_iiser
Thanks a lot , my application is cryogenic in nature. I am trying to make a Sub-Angstrom resolution Thermal expansion sensor, whose components have been machined out of OHFC copper, and i needed to solder a manganin wire to one of the capcitor plates
Electronics Forum | Thu Feb 05 02:43:22 EST 2015 | sarason
Hi.. Hommer, I am not able to install the Vision > tester software for ESV304 machine. It is giving > an error in the installation "Unable to load > HINST.dll" and software asks to re-install the > same again. I tried a lot. but all in vain. > P
Electronics Forum | Fri Feb 20 10:27:37 EST 2015 | emeto
If you are in standard specs, don't even mention it. THe RoHS thing in electronics becomes more and more annoying. I haven;t seen people taking out PCBs from their electronic devices and start to chew them. So it was ok to use gas with Lead for deca
Electronics Forum | Tue Feb 24 15:40:08 EST 2015 | mbartel
I'm new in this industry and need a little direction. I have a wide verity of SM parts on a board, top and bottom. The larger components have a very nice reflow, good shine. The 0402/0201's has a dull almost cold solder look. The boards function and
Electronics Forum | Wed Feb 25 15:16:56 EST 2015 | dyoungquist
We have MY12 and MY15E machines. I am going to assume what we are seeing also applies to the MY100 series machines as well. Do you have the electrical verifier option that works with the midas head and centering jaws to check component values of
Electronics Forum | Wed Mar 04 11:20:19 EST 2015 | jorge_quijano
Hola, I'm about to evaluate our BGA capabilities by using a dummy PCB+Components kit, I'll be evaluating solder paste, pick n place, reflow process & rework method. I have an idea of how to validate these processes. I'm planning to send different sa
Electronics Forum | Wed Mar 25 15:12:14 EDT 2015 | marcelorotofrance
Hi, Bob you're right. I replaced the Z-rod and the machine started to go alright. When I examined the head's mechanism I omitted to check the most exposed an delicate part... my bad. The old Z-rod came with the machine, and its slide movement was loc
Electronics Forum | Fri Mar 20 07:42:44 EDT 2015 | eezday
Dendrite growth is not typically associated with a flux reation but rather is a result of mechanical stress. The stress can be from any source including stress induced by other components, environment, plating or even bimetallics. Dendrites are most
Electronics Forum | Mon Apr 06 09:04:31 EDT 2015 | jesseoliveira
Hi all! I work in FA Lab on Brazil. Recently we had a problem with a dye pry analysis of BGA component due to breakage of WLP package (wafer level packaging). In this case, WLP thickness is about 0.28mm and was damaged during pullout process. Our
.gif)
