Electronics Forum | Sat Sep 05 18:51:34 EDT 1998 | Graham Naisbitt
John, I believe that your problem is cuased by inadequate filling of the transformers with potting material - if any is used at all. When you attempt to clean, particularly with a chemistry, it is designed with wetting agent, surface tension modifier
Electronics Forum | Mon Aug 24 08:29:05 EDT 1998 | Chris Fontaine
Kc, Bent leads are a major defect driver for us, and despite much research I have yet to find a lead straightening device which is not labor intensive. I do however have some limited information about a machine called the "Top Form 2020" by Polytool
Electronics Forum | Thu Aug 27 19:46:21 EDT 1998 | Kallol Chakraborty
Thanks very much. | Kc, | Bent leads are a major defect driver for us, and despite much research I have yet to find a lead straightening device which is not labor intensive. I do however have some limited information about a machine called the "Top
Electronics Forum | Thu Aug 06 13:09:37 EDT 1998 | Ben Salisbury
| Is there any problem using SMT on gold boards? 15 years ago we were told not to use gold boards, but I can't remember why. Judging by the other postings it now appears to be common. Only problem I see is that the nickel should be plated, not ele
Electronics Forum | Fri Aug 07 10:14:43 EDT 1998 | RWW
| I'm currently running a double sided paste smt board loaded with 0603's, on the secondary side. Many of the 0603 devices tombstone during reflow if the parts are not perfectly centered on the pads. Is this caused by the .008 foil thickness? Has any
Electronics Forum | Mon Oct 19 17:43:12 EDT 1998 | John Gregory
Ryan - I noticed your comment concerning solid solder and was compeled to drop a note. We have developed a process which uses some material characteristics from earlier efforts with this technology and profiled it for flip chip and area array attach
Electronics Forum | Mon Oct 19 17:45:25 EDT 1998 | John Gregory
Dave - I noticed your comment concerning solid solder and was compeled to drop a note. We have developed a process which uses some material characteristics from earlier efforts with this technology and profiled it for flip chip and area array attach
Electronics Forum | Mon Jul 27 12:24:29 EDT 1998 | Bill Schreiber
Ablestik 20021 Susana Rd. Compton, CA 90221 Tel: 1(310) 764-4600 Fax: 1(310) 764-2545 Grace 55 Hayden Ave. Lexington, MA 02173 Tel: 1(617) 861-6600 Fax: 1(617) 861-9590 Emerson Cumings makes a yellow. However, I do not have any contact info. Good luc
Electronics Forum | Sat Jul 25 11:11:09 EDT 1998 | Mike Moninger
| Be consistant on: | 1 Keeping the coating material thinned. | 2 Using the same dipping motion on each board. Amen on thinning the coating, and you might also be concerned about the curing mechanism for the coating. Moisture-cured and 2 component
Electronics Forum | Wed Jul 22 12:47:23 EDT 1998 | Earl Moon
| I'm trying to put together a set of design guides for use for new designers | in house or to be sent out for contracted layout work. I would like to start with a top ten list of things that will go wrong if rules aren't available. For example testp