Electronics Forum | Thu Dec 13 20:54:23 EST 2001 | davef
There is neither �nominal thickness� nor �is there a set maximum� for via masking. We use some of our vias as test pads. So, as you�d expect, we get rabid when we get mask bleed onto these pads. IPC-6012 - Qualification & Performance For Rigid Pri
Electronics Forum | Mon Jan 14 15:15:25 EST 2002 | burb1999
Currently our company is in the process of putting together a SMT prototype line... I have experience with fuji, universal, DEK, MPM, BTU, Electrovet in a high volume application. Now with prototype builds we have narrowed down a few and would like
Electronics Forum | Mon Jan 21 15:55:53 EST 2002 | Yannick
The point behind traces and vias on my test is that I don't only want to perform test on printing and placement but on reflow too, so a board with many components and no trace will not react like a board with traces on it. Unless you or someone else
Electronics Forum | Thu Jan 24 16:17:31 EST 2002 | mzaboogie
I have recently been asked to look into some problems that we are having at wave. It is common for us to have unsoldered joints for boards that have SMT parts epoxied to the bottom side. Recently we have had a problem with a gold plated board. The wa
Electronics Forum | Wed Jan 30 08:30:33 EST 2002 | seto
Hello Dave, Mechanically the conection between the component pad and PCB pad is good (the solder joint is very strong). The problem is associated with poor contact after the use by the customer (vibration, temperature, etc). You can see the pictures
Electronics Forum | Thu Apr 25 09:34:24 EDT 2002 | fmonette
Michael, By the way, the default bake duration should be 48 hours at 125C instead of 24 hours. The shorter duration was based on a standard that is now obsolete. The current revision of J-STD-033 includes a variable duration bake table, based on co
Electronics Forum | Mon Feb 11 13:00:00 EST 2002 | Roy Barton
I am looking for some equipment with a fairly undemanding capability. I would appreciate pointers to potential suppliers. Dispense size 0603 chips only, speed can be as low as 60 chips per minute. Only one type of component (ie one reel) is loaded.
Electronics Forum | Mon Feb 11 21:54:14 EST 2002 | davef
LONG TERM Your plans to buy a vaccuum bag resealer and a batch drying oven sound good as you say, but you�re correct. They will not help with this current situation. SHORT TERM If your connections are clean, free of pits and holes with a smooth,
Electronics Forum | Tue Feb 19 15:59:55 EST 2002 | pjc
Surface tension is a likely cause. Surface tension is a negative wetting force. You may have a solderability problem. Be sure your flux is properly activated according to the flux mfg. top side board temp. specification. When surfaces to be soldered,
Electronics Forum | Wed Feb 27 14:07:25 EST 2002 | Stefan
In order to kiss off the components with an air blow, there are two times to consider: 1. reaction time of the solenoid ( to shut off the vacuum and turn on the air ), 5-10 ms 2. time required to fill up an air hose, which leads to the nozzle. Assumi
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