Electronics Forum | Wed Jun 18 12:56:31 EDT 2008 | ampearl
I need to find a qualified candidate to join a communications company in the SMT department. The project calls for an individual who has worked with product development building prototypes and testing them in an R&D environment, as well as workin
Electronics Forum | Fri Jun 20 09:20:04 EDT 2008 | ampearl
I need a technical specialist to turn-on, trouble-shoot, modify, repair, and test the power supply prototypes at the printed circuit assembly and instrument levels. This person would be involved in setting up both manual and automated tests, making m
Electronics Forum | Thu Jun 26 14:25:19 EDT 2008 | jax
Current Acceptable HMP Soldering Methods: 1. Wave / Selective Solder: Some Brands require upgrades to heating elements and Pot materials 2. Laser: Works well with PTH and medium/large passive SMT. Damage to PCB masking can occur when try
Electronics Forum | Sun Jul 13 16:51:08 EDT 2008 | edmentzer
We are a small contract manufacture who started out using the component manufactures part numbers. That lasted about one month then we had an apple and orange with the same part number. I looked at what my customers were using, one had a real good
Electronics Forum | Tue Jul 29 12:51:40 EDT 2008 | grics
I am having some problems with some of my pcbs at ive solder. We are using an ersa versaflow. It has an automated spot/spray fluxer (Interflux Pacific 2009M) , 1 preheat stage, a leaded pot/nozzel, and finally a lead-free pot/nozzel. Nozzels move, b
Electronics Forum | Thu Sep 11 11:45:33 EDT 2008 | swag
Never did find a fool proof solution. Solderability seemed O.K. (at least using the methods we have available in house). Tinned parts and placed by hand and saw little improvement. Pad design is slightly different than recommended but likely not i
Electronics Forum | Tue Sep 02 15:29:36 EDT 2008 | bvdl
small pads like 0402 tend to get hot quite easily. looks like excessive heat is your problem here. pads are wetted, component leads are not. this means solder paste flux on top layer was exhausted before entering in reflow. your profile is the 'in-be
Electronics Forum | Mon Dec 15 15:34:17 EST 2008 | dyoungquist
Sorry it has taken me so long to respond. I got pulled off onto other projects and was not able to work on the solution to the problen until recently. The solution we have come up with is to change from no-clean flux based solder paste to water sol
Electronics Forum | Mon Sep 08 14:29:04 EDT 2008 | davef
�Another direct measurement to determine resistivity values (i.e. of remaining no-clean residues) can be performed through impedance spectroscopy. The surface resistance underneath chip resistors and capacitors can be determined to show the improveme
Electronics Forum | Fri Sep 19 10:24:10 EDT 2008 | jtownsend
I am looking to replace our current smt line of a Contact 3S. This has been our only machine and we have had it for about 6 years. We are looking for 100 plus feeder capacity and 10k plus placement rate with a diverse component range. I am considerin
