Electronics Forum | Wed Sep 20 16:15:53 EDT 2017 | davef
Some requirements to consider are: * Humidity and temperature controlled according to J-STD-001 * Electro-static discharge (ESD) control program according to ANSI/ESD-S-20.20. * Soldering technicians are trained and certified according to J-STD-0
Electronics Forum | Wed Oct 18 09:32:05 EDT 2017 | alexeis
Hi, Pick and Place file is included in CAD file. CAD file contains full information about a board including internal layers, silk, PAD/Component structure, and more. You can use Pick and Place (PnP) file on preparing SMT Programs. In case of small
Electronics Forum | Thu Oct 26 21:48:57 EDT 2017 | deanm
For selective soldering I would first look at the alloys your products require. Do you run tin-lead, lead free or both? If you run (or may run in the future) two alloys, then look for a machine that has quick change solder pots. Secondly, do your bo
Electronics Forum | Tue Nov 07 00:33:40 EST 2017 | aqueous
If no-clean flux is reflowed correctly, many of the activators are encapsulated within the resin residue left behind after reflow. An ionic contamination test cannot differentiate between ionic residue that was encapsulated (not harmful) and residues
Electronics Forum | Wed Nov 15 12:52:21 EST 2017 | georgetruitt
IMO – Look into nano-coatings for your stencil and radius all square apertures This should help out with solder paste releasing from the stencil helping with insufficient solder QFN LGA aperture design, try a stencil cut with a few different apertur
Electronics Forum | Thu Dec 28 16:20:12 EST 2017 | rgduval
Pictures of your issues would help us to help you. Pin holes/blow holes are generally caused by either moisture or flux volatiles/organics. Since you've virtually eliminated moisture, it might be time to look at your paste/flux. You can call eithe
Electronics Forum | Sun Jan 07 08:46:08 EST 2018 | spoiltforchoice
Your paste should specify a number of times it is OK for various things to happen. The two you might care about are the "Stencil Time"/"Working life", which is how long the paste can be out of the pot on your stencil while you print PCBs. The othe
Electronics Forum | Sun Jan 28 03:54:19 EST 2018 | alexeis
Hi, We have a solutions that is exactly for you: QPlace - basic solution for machine programming including XY reading and validation (with reports), BOM reading and validation (with reports), comparing and merging BOM/XY information (with validation
Electronics Forum | Tue Jan 30 01:06:51 EST 2018 | dgassier81
Hi, In our shop we've always baked out PCBs and moisture sensitive parts prior to electronic assembly using a gentle ramp rate of 2 degC/minutes going hot (93degC) and same ramp rate going cold (back to room temp). We're trying to outsource that pro
Electronics Forum | Tue Mar 20 03:55:38 EDT 2018 | rob
MTC = Multi tray changer. It's a stand alone unit that feeds in trays of components - it means you don't sacrifice feeder locations to waffle packs. Different companies call them different things. A 760 is dog slow, and spares are getting harder to