Electronics Forum | Sun Oct 09 11:16:06 EDT 2016 | mekmat
Hello, I would like to ask you about the minimal distance between components and border of pcb especially V-cut to avoid crack of component during depaneling? I need some standard (IPC or something) where is this defined? Thank you for your support
Electronics Forum | Sun Oct 09 16:57:30 EDT 2016 | davef
IPC 2222A Sectional Design Standard for Rigid Organic Printed Boards, 5.3 Design Requirements for Printed Board Assembly
Electronics Forum | Sun Oct 30 12:39:13 EDT 2016 | mekmat544
Thank you for your answer, but I am litte bit confusing. There are parameters of V-scoring but with put values. How can I get values for V-scoring for pcb 1,6mm thickenss. Thank you. M.
Electronics Forum | Sat Nov 05 20:23:11 EDT 2016 | sarason
Close but not to close, would have to be the spec. Or depends on your separating technology. Prerouted boards on a panel, you could go right up to the edge. V-grove you will need more distance, maybe 2mm's or more. The distance from the panel edge to
Electronics Forum | Tue Nov 01 12:28:36 EDT 2016 | comatose
It depends. Are you hand breaking them, rotary knife or linear knife? Hand break you want to be about 5mm (and it isn't a great practice even then) with a rotart knife you want to keep parts probably 3mm, especially capacitors. With a linear knife we
Electronics Forum | Thu May 22 18:47:12 EDT 2003 | russ
I would assume we are talking about a radial leaded electrolytic cap? We use Electronic grade RTV (Dow corning 3145). It sticks good and can be removed if necessary. It is also pliable so you don't have to worry about CTE or other stresses that may
Electronics Forum | Mon Jun 08 14:19:30 EDT 1998 | Gary Simbulan
Earl, et al, Boy things get old and cold around here fast. I promised more detail on my capactior problem and I thought I could drop something completely different in the same message and tell a tale of solder balls. First the caps. We still have
Electronics Forum | Tue Mar 12 09:56:50 EDT 2013 | emeto
Hi, I don't know what you mean by really odd parts. Are they SMT parts that have a flat surface to pick them up? If so, probably several machines can do it. I know for sure Siemens can place almost anything. THey will help you with any type of nozzl
Electronics Forum | Wed Sep 10 12:56:09 EDT 2003 | davef
Intermetallic compounds [IMC]: * Form during the alloying process of some metals. In soldering these are Sn, Ni, Ag, Cu, Au. * Do not accept solder. * Increase in depth in logarithmic proportion to both time and temperature. [So during the solder
Electronics Forum | Wed Oct 10 13:35:00 EDT 2001 | stepheno
I used to work with Chris. (neither of us are there anymore). What is he talking about is putting components into "pockets". The parts would come in, in sticks (tubes) but we wanted them in reels. At first we sent them out to be reeled, but that w
