Electronics Forum | Tue Mar 18 12:38:39 EDT 2008 | fsw
Hi! Can anyone tell me what is the min spacing between PCB edge & land pattern to avoid cracking of components due to mechanical stresses caused while depaneling with cookie/pizza cutter. Thnx!
Electronics Forum | Wed Jun 30 10:37:11 EDT 1999 | Boca
We are wave soldering some fabs with a lot of unmasked trace area along the edges. The trace area is solid copper covered with tin / lead, no masking, no components along the edges, same on solder side and component side (goofy board design). Inste
Electronics Forum | Mon Sep 06 09:03:45 EDT 2010 | aj
Hi all, Looking for some advice on how to run this component through the SMT process or is it always hand soldered? Part number is HSEC8-120-01-S-D-EM2 We are currently handsoldering. aj...
Electronics Forum | Thu Mar 20 17:39:41 EDT 2008 | boardhouse
FSW, Another suggestions is if you have rail on your product and you are concerned about stress fracturing certain components you could add a routed slot to add relief in that area. So when you snap the rail off their would be no stress in that area
Electronics Forum | Wed Oct 26 16:47:17 EDT 2005 | jdengler
I have never heard of heating the board for separation. You may want to try some of the following. -Using a roller cutting type depaneler helps reduce the stress. -Using a combination of routing in areas with components near the edge and v-score th
Electronics Forum | Mon Jun 20 04:21:04 EDT 2005 | alex
What is the ideal component edge to board scored edge clearance?
Electronics Forum | Mon Jun 20 09:12:55 EDT 2005 | davef
There's no easy answer. It depends on: * Thickness and size of the PCB in the array. * Means of separation. * Type of component. SMT components are more sensitive to the forces that need to be applied to separate the PCB. * Type SMT device. Ceram
Electronics Forum | Wed Jun 30 11:38:05 EDT 1999 | Brian Conner
| We are wave soldering some fabs with a lot of unmasked trace area along the edges. The trace area is solid copper covered with tin / lead, no masking, no components along the edges, same on solder side and component side (goofy board design). Ins
Electronics Forum | Wed Jun 30 12:14:40 EDT 1999 | John Thorup
| | We are wave soldering some fabs with a lot of unmasked trace area along the edges. The trace area is solid copper covered with tin / lead, no masking, no components along the edges, same on solder side and component side (goofy board design). I
Electronics Forum | Fri Jul 02 09:54:02 EDT 1999 | John Thorup
| | | | We are wave soldering some fabs with a lot of unmasked trace area along the edges. The trace area is solid copper covered with tin / lead, no masking, no components along the edges, same on solder side and component side (goofy board design)
