Electronics Forum | Sat Jan 24 00:13:57 EST 1998 | Scott
| What is the lifetime for a typical solder paste ? | How long can boards be stacked waiting before the paste goes off ? Lifetime and tack time depends on: - Manufacturer - Flux/mixture - Environmental conditions Typical lifetime is dependent on stor
Electronics Forum | Mon Jan 26 08:58:05 EST 1998 | Mike McMonagle
| I have the following questions with regards to the solder printing stencil design : | 1) Is the Electro-polish process recommended for laser cut stencil ? | 2) Should the aperture walls be slanted at an angle or straight wall, i.e. trapezoidal |
Electronics Forum | Fri Jul 09 16:50:25 EDT 1999 | Mark
There is a company named BGA Bumps that reconditions BGA IC's. Check out their web page www.bgabumps.com(below). As far as process specs you should look at the July 1999 issue of Circuits Assembly Magazine detailing many complex rework process and co
Electronics Forum | Thu Aug 16 19:56:38 EDT 2001 | davef
Awww, blank those fine tech support people at MPM. We know more than they do. Having said that, duh, umm er, please clarify the problem. * Are you concerned about paste squirting through the holes of the side 2 portion of the stencil when you are
Electronics Forum | Sat Sep 08 12:19:48 EDT 2001 | davef
Depending on how odd the form is, would a pen-vac work? Virtual Industries and Exalta sell Pen-Vac vacuum pick-up tools through distribution [eg, Wassco, Practical Components, Techni-Tool, etc] for about $30. Pen-Vac is a self-contained vacuum pic
Electronics Forum | Fri Oct 19 09:06:00 EDT 2001 | LW
I was somewhat involved with Kermit Aguayo during his work on the SMA-void problem, as I was with one of the SMA suppliers at the time. I recall the problem being related mainly to absorption of moisture by the uncured adhesive. Some SMA formulatio
Electronics Forum | Tue Dec 11 20:22:33 EST 2001 | mparker
in your example, wool clothing and prairie winter ionization makes sense. Smocks would be an improvement to contain the potential of static build up. If you go to dress codes, then you run the risk of having to provide uniforms or pay a laundry allow
Electronics Forum | Fri Jan 04 15:42:03 EST 2002 | nwyatt
There are several implications: - some lead free alloys do not form an acceptable solder joint when used with lead contaning paste. (ie. Bismuth) - if you use both lead free and lead containing components, you will have different solder joint compos
Electronics Forum | Sat Jan 05 10:21:29 EST 2002 | Todd Murphy
Has anyone ever had any solder related problems with the Motorola 860 BGA? We are currently using the 860 on several of our products and some of the solder joints for the 860 look like crumpled aluminum foil when viewed with the Ersa Scope. Does anyo
Electronics Forum | Sat Mar 30 10:50:38 EST 2002 | stefwitt
Some earlier machines with mechanical component alignment could be bought with electrical test options ( Mydata, Siemens o.a.). This is, to my knowledge, the only method to identify chip components prior placement. The downside was a high reject rat
