Electronics Forum | Thu Sep 01 02:47:01 EDT 2005 | stalkerb
Thanks Cmiller & PR, I am warmed to hear others are doing this sort of thing.......like all inovative ideas, you often stumble into them. As far as im aware the ERSA dual Pot is the only machine avaiable on the market that can do this sort of thing
Electronics Forum | Wed Sep 07 04:28:26 EDT 2005 | Slaine
were looking at paste, wire, preforms and solder bars (for solder pots), concentraiting on HMP, sn62,96S, and 2 different sac alloys, we also have 7 different fluxes and 16 temination inks (which were also having to change for RoHS because the ink co
Electronics Forum | Thu Sep 15 22:00:17 EDT 2005 | LeeHoMa
hi Stephen, Thank for your comment! Yes! My people also share the same view that customer is asking something which is in more theoretical side. They want us to collect a lot of statistical data to prove our process. Anyway, customer is not only
Electronics Forum | Mon Oct 10 16:02:58 EDT 2005 | pjc
If you don't have a machine, such as from these guys: http://www.pressureproducts.com/SPPC_Hm.htm http://www.smartsonic.com/index2.html http://www.aqueoustech.com/Ultrasonic_Series_Data.htm http://www.emcgti.com/products/product_list.php?cat=8&ca
Electronics Forum | Wed Oct 12 20:53:44 EDT 2005 | mderen
We are currently wave soldering connectors that are held in place by stainless steel screws. About 20% of these screws emerge from the process with varying quantities of solder attached to them. We have just had our solder bath checked and no impurit
Electronics Forum | Wed Nov 02 01:30:12 EST 2005 | fctassembly
Hello Arnold, Yes, by definition of joint formation, copper will dissolve in lead free solder in order to form the connecting intermetallic layer. There is a distinct difference in the copper dissolution rates of the major alloys being considered wi
Electronics Forum | Tue Nov 08 20:50:03 EST 2005 | davef
First, general comments about voiding in wave soldered connections are: * Causes of voids in solder connection are many: moisture, flux/paste volatiles, wave process, etc. * Impact on reliability of voids in a PTH solder connection is insignificant,
Electronics Forum | Thu Nov 10 07:57:51 EST 2005 | davef
AJ: Problems with IPA are: * IPA / material being 'cleaned' combination still needs to be removed from the stencil. * IPA and empty containers are a hazardous material by RCRA criteria (40CFR 261) * Flash point (~12*C TCC) of IPA is low enough that a
Electronics Forum | Fri Nov 11 10:19:35 EST 2005 | davef
0.3 mg/l) is a �hazardous substance containing waste�. Disposal permitted only in controlled landfills, mfrs. pay extra costs (Waste Disposal and Public Cleansing Laws). * South Korea: Korean Electronics Industry Declaration to Manufacture Environmen
Electronics Forum | Wed Feb 08 04:08:35 EST 2006 | fctassembly
Hello Greg, I agree with you that the article in SMT Magazine should be studied very carefully as it contains many errors in respect to SN100C. The testing performed was a DOE and was not an optimized run. There is also a statement on dross generatio
