Electronics Forum: contains (Page 61 of 81)

Re: Temp Profile for 0.05 pitch

Electronics Forum | Mon Mar 02 23:08:50 EST 1998 | Scott McKee

Can anyone advise a good starting point for a temp profile for on 0.05" and 1206 component boards? These boards are simple by todays standards and do not contain any fine pitch or other special components. Thanks in advance...

Re: Solder Paste

Electronics Forum | Wed Jan 28 19:39:08 EST 1998 | Steve Gregory

What is the lifetime for a typical solder paste ? How long can boards be stacked waiting before the paste goes off ? Lifetime and tack time depends on: - Manufacturer - Flux/mixture - Environmental conditions Typical lifetime is dep

Re: white dirty solder

Electronics Forum | Mon Jan 26 11:46:16 EST 1998 | Rin Or

I have a problem! The solder on my pc boards look great comeing out of my reflow oven. They go thrue the rest of the prossese and at the end at the qc station it's cold or whitish or gray not shiny. does any one have a idea on how to correct

Glue Dispense Process Control

Electronics Forum | Fri Aug 10 13:28:19 EDT 2001 | Hussman

Hey John, You're not alone, a lot of people have the same problem with different machines and material. What is your specific problem, just keeping SPC control? Or are your defects at the wave from the glue too? If it's a process problem, I found

Possible to temporarily store mounted but not soldered PCB's?

Electronics Forum | Wed Sep 05 08:50:04 EDT 2001 | davef

No arument with others comments about moisture, but taking a different tact, consider that the volitle elements of the solder paste disppear as a function of the amount of time the paste is out of the container. [Maybe as a function of solder paste

External Factors to be controlled during assembly

Electronics Forum | Thu Sep 27 19:52:28 EDT 2001 | davef

All of the discussion of "environmental controls" are a matter of degree, dependent on the requirements of the product that you manufacture. For example: shops assembling under-the-hood products have different requirements than shops making garage d

Fine Pitch QFP Bowing after reflow

Electronics Forum | Wed Oct 17 09:38:55 EDT 2001 | fmonette

Dear Daniel, I assume that these components are moisture-sensitive. If they have absorbed too much moisture prior to reflow you might be experiencing popcorning. This typically shows up as a bulge over the surface of the die, in the center of the p

BGA Via Plugging

Electronics Forum | Thu Feb 07 20:53:51 EST 2002 | davef

Regardless of the technique used for the mounting pad shape or definition, isolation of the plated through hole [PTH] from the mounting pad is important. If the PTH is contained within the mounting pad, solder will wick down the PTH. The amount of

Through-hole Connector Wave Solder Questions

Electronics Forum | Wed Feb 20 19:57:27 EST 2002 | davef

THIEVING * Layout: I�d guess the surface area of your thieves is not large enough. The pull from the thief is not great enough to over-come the pull from the connector pins and pads. Consider tripling the size of the thief. As you say, reducing t

omega meter

Electronics Forum | Wed Mar 06 21:16:17 EST 2002 | davef

�What does 5 micrograms of chloride mean to me?� * With SIR testing, you can show no detrimental leakage currents under humid conditions, no corrosion, no metal migration, which are the big factors in figuring out electrochemical reliability. People


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