Electronics Forum | Sat Jun 15 22:39:05 EDT 2002 | edahi
well we can't paste the flip chip on its substrate because we are using flux...because this bare die yet...and the surface of the die flipped might be contaminated...also after chip attach and reflow the die is to be underfilled and if the die is pas
Electronics Forum | Fri Jul 26 17:02:07 EDT 2002 | davef
Never heard of flux residues forming a lense. The first thing that comes mind when thinking about your 'fog test' is: Ionic Contamination While this seems pretty far afield from your interest in optical effects, I'll continue briefly. A reverse
Electronics Forum | Thu Aug 01 14:24:11 EDT 2002 | gdstanton
We've been running Kyzen XJN+ with our new Westek Trek IV cleaner for months and have had few problems with ionic contamination. Prior to that we've used Kyzen products forever. Recently a Zestron rep did a sales pitch claiming a 50% savings if we
Electronics Forum | Sun Sep 22 13:14:56 EDT 2002 | scottefiske
Stop the lines...! Stop building defects and rework into your product. Contact Fab Supplier and have pipeline filled for small amount of replacement fabs to keep lines running and limiting production scheduling and impact. Request to have the board
Electronics Forum | Mon Sep 23 12:42:15 EDT 2002 | dragonslayr
yea - yippie- Scott's the man!!!! good answer - I support the notion that in the long run, stopping the line, getting the root cause determination, is not only effective but efficient. It is hard to do because we all are so used to fire fighting on
Electronics Forum | Wed Nov 06 08:59:51 EST 2002 | rmorford
This defect is there after reflow. My first thought was that the boards had some sort of contamination, too. This is a new PCB manufacturer for this board (they have been making other boards for us). But... why only on the connectors -- why only o
Electronics Forum | Thu Dec 05 11:36:30 EST 2002 | William Guatemala
Have you check the flux gravity lately? If not, Check the flux gravity every 6 hours to make sure proper parameters are meet. Here is a list of things that may cause your solder ball problems; Excecive heat, defective fixtures, preheating temperature
Electronics Forum | Mon Dec 09 08:30:13 EST 2002 | MA/NY DDave
Hi Well you already got good answers with some diversity, yet from what I read they are giving you the answers for Assembled PWBs, i.e. post solder or PWAs. I don't remember ever doing this for raw boards. For most of the current pwb finishes it se
Electronics Forum | Fri Feb 21 12:49:26 EST 2003 | slthomas
Because it's not limited to one part type and he's verified his profile...what else is there, unless the profile isn't what he thinks it is? My question is, why does it stick to the boards but not the parts? Is the difference in bonding strength i
Electronics Forum | Mon Feb 24 15:14:21 EST 2003 | blnorman
Having worked with adhesives for years, the first thing to look at if there is a failure of this type is surface contamination. The subject has been discussed here also. A structural adhesive will increase in strength with a "hotter" cure. We also
