Electronics Forum: contaminations bond (Page 1 of 6)

Wire bond failure

Electronics Forum | Thu Jan 15 15:16:56 EST 2009 | jsherrow

We recently had our customer report a component failure trend of a few percent. Analysis indicates wire bond failure internal to a d-pak caused by what appears to be chlorine contamination. We're running a lead free process with aqueous wash. 700 co

COB Issue's (Non-Sticking)

Electronics Forum | Wed May 18 07:22:06 EDT 2005 | davef

Wire bonds don't stick when bonded * Check pull and shear strength. * Depending on point of failure, review parameters. * Listen during bonding, if there is a high pitch buzz, there is vibration in the system somewhere, "seek and destroy". * Get the

Contaminants after SMT which affect wire bonding

Electronics Forum | Thu Oct 05 16:04:00 EDT 2006 | GS

I am not expert, just my comment, the total ionic contamination allowed after SMT, by using No Clean process, theoretically it should be close to Zero. Any way the Standard IPC-JSTD-001 allows 1,56 ugr NaCl/cm2 for the final Printed Board assembled.

Wire bonding pull strength & substrate contamination

Electronics Forum | Thu Nov 03 07:43:52 EST 2005 | davef

Questions are: * Is the problem 'wire bonds that don't stick' or 'wire bonds that fall or break off later'? * What materials are you working with? * What is your working time after plasma clean? * What does surface analysis tell you about surface con

Contaminants after SMT which affect wire bonding

Electronics Forum | Thu Oct 05 07:23:34 EDT 2006 | Chris

Hi all experts, I have no background about PCB or SMT process. I am now encountering some issues after SMT - Unstable stitch bonding condition. I am now suspecting some contaminants remain on lead after cleaning. Therefore, how can I check th

ks bonding problems gold wire on al pads

Electronics Forum | Tue Nov 07 22:44:39 EST 2017 | wrander1

Hi I'm new to the world of wire bonding. I seem to have some sort of pad contamination Preventing gold wire from bonding to aluminum pats. There appears to be a dozen microns size particles. And a slight crackling of the surface at 500 X. I am send

Wirebond issues near SM

Electronics Forum | Thu Oct 29 20:19:43 EDT 2009 | 89jeong

Hi. We are doing Au bonding on Al bond pad not Au plated. If pull strength is less than 2.0g, i think that the ball or stich may be lifted from bond pad. And the value become lower after several reflow. I expect that the surface of bond pad may be c

ESD kapton tape for SMT production use

Electronics Forum | Wed Jan 22 10:24:23 EST 2014 | cyber_wolf

No matter how good your process is, you will get solder on the gold fingers/lands unless they are protected. We have proven that solder will get on the gold fingers in the reflow oven. How that happens....we arent't 100% sure...there are a lot of the

Wire bonding pull strength & substrate contamination

Electronics Forum | Thu Nov 03 02:34:46 EST 2005 | Rosewood

We've recently encountered some problems with wire bond strengths. I'm looking for anybody that has had some experience with different types of substrate contamination and methods for cleaning. There is no visible contamination on the gold pads, bu

Contaminants after SMT which affect wire bonding

Electronics Forum | Fri Oct 06 04:23:06 EDT 2006 | David

What is the solder finish of the board?. If this is gold, maybe you should check the reflow profile and max temperature which can easely kill your gold coating so problems with bonding. Also we are using Prozone Multicore with ultrasonic to clean

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