Electronics Forum | Mon Nov 27 12:22:52 EST 2000 | rabell
You might want to check with Atlas Copco re the characteristics of the tool case. Although it is plastic, it could have been formulated to be dissipative. Unfortunately, with power tools there is always the conflict between the need to isolate the
Electronics Forum | Wed Sep 20 09:02:24 EDT 2000 | Erick Russell
The programming is simple and is based on just a few simple parameters. There is no CAD interface required to program the equipment. You must key in the dimensions of the component (X-Y and Thickness) and then specify the required thermal process.
Electronics Forum | Wed Aug 23 17:06:40 EDT 2000 | Dr. Ning-Cheng Lee
For 20 mil pitch pads, the volume control is more critical in terms of bridging concern. In general, solder paste for dispensing is more prone to slumping due to low metal load and low viscosity. If the volume dispensed is on the high end, or if the
Electronics Forum | Tue Aug 22 16:13:08 EDT 2000 | Dr. Ning-Cheng Lee
FR-4 will be OK for small products such as cellular phones. Here the temperature gradient across the board may be 3-4C only, and the board temperature can be well controlled. At temperature above around 245C, the discoloration and delamination may be
Electronics Forum | Thu Jul 20 12:30:29 EDT 2000 | Bob Willis
Personally I would go for one alloy it just makes it all simple to control. I have only used tin/silver and tin/copper so far with good process results. Reflow is relatively straightforward, I have had more shorts with wave on tin/copper. To date I
Electronics Forum | Thu May 10 10:27:29 EDT 2001 | davef
It depends ... * Components stored in a garage in Chiriqui,Panama will have a different shelf life than those store in a climate controlled room in Ayrshire, Scotland. * Components from a reputable supplier will likely have a different shelf life tha
Electronics Forum | Wed Sep 12 12:55:34 EDT 2001 | stevearneson
The CyberOptics LSM 300 cannot provide true 3D volumetric measurements. It is impossible to measure volume using a "Box" that is drawn around a feature without the same characteristics. Owners of the LSM 300 try it for yourself. Move the stripe ar
Electronics Forum | Wed Sep 12 18:08:15 EDT 2001 | davef
I missed the laundry part [but then again, I couldn't figure-out that "AMT" as THE typo] That aside, I have no problem with what Cyber said. Continuing, we have talked about all of the following issues in previous threads on SMTnet: * LSM 300 does
Electronics Forum | Wed Jun 06 13:38:15 EDT 2001 | Michael Parker
To expand on Wolfgangs reply, I suggest you contact your local SRT rep. We recently had the same type of problem as yourself. This is the path we followed. Arrange for operator training, for yourself first, then the operators after you get the machi
Electronics Forum | Tue Jun 19 12:15:45 EDT 2001 | Gil Zweig
I have made reference to X-ray Ball Bond Signatures a number of times, and I cannot overstate the importance of quickly qualifying the overall ball bond pattern as either uniform in size and shape or not. Software is available that will make this qua
