Electronics Forum: control (Page 311 of 369)

IPC-9850

Electronics Forum | Thu Mar 06 16:34:54 EST 2003 | msivigny

Hello gregp, IPC released 9850 on October 22, 2002 after the industry came together to standardize a method to determine placement capability as it relates to placement speed. As I'm sure you are aware, the standard gives placement machine manufactur

AOI, Pre or Post Reflow?

Electronics Forum | Mon Mar 10 10:14:10 EST 2003 | pjc

Most pre-reflow AOI systems today can easily keep up with production line beat rates. Pre or Post reflow AOI is the difference between process control vs. defect screening, in my opinion. Pre reflow repairs cost much less than post. Pre AOI is for

SMT process Blowhole/ Pinhole

Electronics Forum | Fri Mar 28 00:56:50 EST 2003 | iman

we have a issue of post-reflow oven (SMT) soldering defects of blowholes and pinholes. Any suggestions or knowledge on root cause is appreciated to be share? BACKGROUND : we DI water wash and oven bake the PCB bareboards at 90deg-C for 60mins, to r

Whitish Solder Joint

Electronics Forum | Fri Apr 04 09:28:59 EST 2003 | davef

Q1: Anyone has any ideas on how this post-SMT reflow solder joint could have changed to whitish joint? A1: Dunno. You need to tell us more. For instance: * What is the appearance of this white residue? [eg, glassy / coarse, milky colored / opaque,

BGA Rework

Electronics Forum | Thu May 08 11:58:12 EDT 2003 | fmonette

Hi Chrissie, This might be old news to you but I just wanted to make sure that you are aware of all the implications of BGA rework relative to the control of moisture-sensitive components. For example, you need to keep track of the total exposure t

Black Pad

Electronics Forum | Thu Apr 24 20:39:01 EDT 2003 | davef

3NaH2PO3 + H2SO4 + 2H2 + Ni^0 Potassium is co-deposited with the nickel, as follows: H2PO2^- + Hads => H2O + OH^- + P 3H2PO2^- + P => H2PO3^- + H2O + 2OH^- Nick Biunno gives a very short, over simplified summary: "Everybody looks at the nickel, b

The machine is only 20%????????

Electronics Forum | Tue Jun 24 11:27:57 EDT 2003 | caldon

Sorry let me explain. It is a ratio. When buying a machine 80% of my evaluation is with the Support. The other 20% is the machine its self. I read the Brochures and Capabilities to narrow my search to the machines meeting my needs. From there i am c

Wave soldering profiling

Electronics Forum | Wed Apr 14 20:48:43 EDT 2004 | Ken

Just a thought.... Some Fluxes require temperatures upto 260F (127C). Are you using water based flux or solvent (alcohol). I have noticed that many wave machines are NOT capable of preheating adequately when using water based materials. This can

Pinhole Solder Joint Reliability

Electronics Forum | Mon Jul 21 08:34:44 EDT 2003 | Don Bell

Blow holes/ pin holes in solder joints are the result of multiple root causes. Suggested analysis might look like this; 1) What method of solder preservation is used on the bare board. (hasl,enig, osp, etc.) HASL can leave unwanted flux residues,

Pinhole Solder Joint Reliability

Electronics Forum | Mon Jul 21 20:42:12 EDT 2003 | iman

Don, thanks for the thoughtful insight, can I run some thinking points for your further assistance? 1) ours is a Au over Ni PCB bareboard. Do you think excessive Au thickness is any way a influence for poor solder formation? I did notice the PCB ba


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