Electronics Forum | Mon Sep 14 07:19:34 EDT 1998 | Wayne Bracy
DB Sure, it is always possible to "duck in outside air" to use with production equipment, but be careful, you have to determine the air quality required for your process. Cosnsider moisture, contaminates and the actual forcing of air into a confine
Electronics Forum | Tue Sep 22 12:52:56 EDT 1998 | Bernard Mulcahy
| | | | | Has anyone been able to link a Mydata with the Pads Software. The book say's it can not be done but someone told you can?????? Could someone put me on the right road. | | | Thank You | | | John Kirby | | John, Mydata themselves will supply
Electronics Forum | Fri Aug 21 14:38:00 EDT 1998 | Earl Moon
| It's been one hell of a week.... | From personal experience, what are the most common causes for embrittlement of the solder joint? I just need to make sure I've got all my bases covered. | thanks | -Ben Right on. Yago sangria. Chili conceso. That'
Electronics Forum | Wed Aug 26 00:16:08 EDT 1998 | Jeff Sanchez
| | It's been one hell of a week.... | | From personal experience, what are the most common causes for embrittlement of the solder joint? I just need to make sure I've got all my bases covered. | | thanks | | -Ben | Right on. Yago sangria. Chili conc
Electronics Forum | Thu Jul 23 11:39:16 EDT 1998 | Russ Miculich
Are you using a HASL board or an organic protection on the pads? This will help determine as to whether paste is necessary or just a very active/tacky flux should be used. Tight process control will also help in the reflow oven. Many users don't wan
Electronics Forum | Wed Jun 24 00:10:07 EDT 1998 | Phillip Hunter
| WHAT IS THE BEST ANGLE FOR THE SQUEEGEE BLADE TO BE ANGLED AT? WE ARE USING 45 DEGREE ON OUR POLYURETHANE BLADES, AND I BELIVE WE HAVE THE OPTION OF EITHER 45 OR 60 DEGREES ON OUR METAL BLADES. WHICH OF THE TWO IS BETTER, OR SHOULD WE BE USING AN
Electronics Forum | Mon May 18 20:57:06 EDT 1998 | Earl Moon
.025" pitch so the only problem we run into is too much HASL on the adhesive side causing improper glue dispense. | As Earl keeps saying HASL thickness is hard to impossible to control. I think we need to look hard at OSP's again but then you get in
Electronics Forum | Tue May 19 16:32:54 EDT 1998 | Chrys
| | Earl, | | I admit that I missed your article since I seemed to have let my subscription to Circuit Fabrication Magazine expire. I am interested in your experience in this area. Is there a way to get a copy of your paper? Could you maybe post i
Electronics Forum | Mon May 18 22:54:04 EDT 1998 | Dave F
.025" pitch so the only problem we run into is too much HASL on the adhesive side causing improper glue dispense. | | As Earl keeps saying HASL thickness is hard to impossible to control. I think we need to look hard at OSP's again but then you get
Electronics Forum | Mon May 18 13:30:15 EDT 1998 | Earl Moon
| I'm reviewing my board fab spec. It calls for a minimum SnPb thickness of 50 microinches on HASL PWB's. I've looked at other specs that call out anything from 30 to 80 microinches, and others that just say the copper pad must be covered and solde
