Electronics Forum: control (Page 261 of 369)

ESD Smocks and chairs

Electronics Forum | Tue Jun 19 21:44:20 EDT 2007 | rfrog

The first thing that I would do is contact the smock manufacturer and ask them for advice on testing the smocks. ESD FROM A TO Z 2nd ed. (Kolyer) states that: smocks should have a resistivity of less than 10^12/sq and must not shed steel fibers.

Wavesoldering capability study

Electronics Forum | Tue Jul 10 11:49:20 EDT 2007 | samir

Parallelism tends to drift: �h After preventative maintenance �h From dross buildup or other obstruction clogging either wave Parallelism should at least be studied during the process characterization stage, so that you know your machine's process

PCB exhibit internal short - x-section find cu residue

Electronics Forum | Mon Jul 16 16:39:17 EDT 2007 | davef

We doubt that entrapped process chemicals cause under-etch. Over-etch maybe, but not under-etch Under-etch is an indicator of improper process control/improper chemistry during etching. Under-etch can result in bridging between traces, resulting in

J-STD-001 Par 4.2.2 Temperature and Humidity

Electronics Forum | Mon Jul 16 15:44:27 EDT 2007 | davef

J-STD-001 doesn't necessarily require additional controls under conditions of low humidity, only that you verify the effectiveness of what you have in place. ESD S20.20 [1999] only says that relative humidity above 30% is "desirable". ESD S20.20 [200

lead free pcb plating?

Electronics Forum | Sat Jul 28 08:37:52 EDT 2007 | davef

There is no good choice. Board Finishes: Industrial/Battelle Class 3 Environment [Reliability Knowledge Gaps: For use of Pb-free solders in High Reliability Applications, J Smetana, iNEMI Availability of SnPb-Compatible BGAs Workshop, March 1, 2007,

When to trash the solder paste

Electronics Forum | Wed Aug 08 17:05:01 EDT 2007 | klaughton

I have instituted a policy that probably seems a little extreme to some, but is worth the cost in my eyes. Once a jar of solder paste is opened, it must be thrown away at the end of the work day (Properly discarded, of course). We use the small 250

Types of OSP Coating

Electronics Forum | Thu Sep 06 22:01:21 EDT 2007 | syedsmt

Hi! I am Syed from Hitachi located in Malaysia.It seems that the discussion about OSP is very much related to the dillema that I am facing in my company.I am the Senior Executive for the SMT Department at Hitachi.Currently we are facing some issues w

Questions about equipment

Electronics Forum | Wed Nov 07 17:57:01 EST 2007 | jmelson

OH! He he, St. Louis! I have recently acquired a very good P&P machine, and am in the St. Louis area. I got the machine primarily for my own manufacturing, but there is plenty of time available on the machine. If you'd like to see how the process

QFN soldering

Electronics Forum | Mon Nov 12 09:22:41 EST 2007 | devajj

BTW, The surrounded QFN fine pitch terminals > should have the normal aperture reduction of 7 % > in case of RoHS Senju solder paste. This works > for our Telecom customer. > > The vias in the > ground pad will be somewhat filled with solder >

SPC Plus 3.4.2.1

Electronics Forum | Sat Jan 19 23:23:45 EST 2008 | bentigano

I'm not familiar with SPC Plus. I'll assume it's a "statical process control" system. We use the SPC data collected by our YesTech AOI system, together with a custom, web-based reporting system for process analysis and defect reporting. I am actually


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