Electronics Forum | Tue Sep 25 14:25:30 EDT 2001 | davef
Points in response are: * Microstencils work fine with paste, although they are a little fussy to use. * Never have used microstencils for flux. * Like Hussman, we dab the uBGA into a puddle of tacky flux and then place it on the board. * On contro
Electronics Forum | Fri Nov 09 16:57:27 EST 2001 | davef
Sure, it�s fine to use the proper amount of flux and no solder when reworking BGA. Recognize that these new solder connections have less metal and a lower standoff than similar BGA solder connections that have not been reworked. This undoubtedly
Electronics Forum | Mon Apr 15 18:59:12 EDT 2002 | davef
Points are: * Seminal study is: "Evaluation of Low Residue Soldering for Military and Commercial Applications: A Report from the Low Residue Soldering Task Force," published by Sandia National Labs in June 1995. Look here http://www.smtnet.com/forums
Electronics Forum | Thu May 09 22:32:50 EDT 2002 | ianchan
Hi Guys, thanks to everyone for their help and advise! we are running these LCC parts in the 1000's, so its going to pose a big problem to either: 1) tin-plate the oxide layer, 2) HCL away the oxide layer, thanks for the option shown, dun think so
Electronics Forum | Wed May 22 13:07:43 EDT 2002 | melsolutions
Tim, have you considered how efficiency software plays a role in the matrix? Most software from equipment suppliers tends to be programming driven. I have run across a software product from Timms that does an excellent job of controling things lik
Electronics Forum | Mon May 27 18:51:17 EDT 2002 | harotec
Hi Yngwie Have you got a reflow oven yet. If not, forget about complicated profiling with test runs or reflow trackers. We've got a nice oven with integrated temperature-feedback system. You build any profile you want and the oven will adjust its hea
Electronics Forum | Wed Jun 26 01:01:24 EDT 2002 | ianchan
Steve, Dason has valid points here. dun listen to what supplier's say about paste lying on the PCB pads able to be exposed at ambient temperatures for 8-24 hrs? that will never get approval for Class-3 type of customer auditors. (Would any serious
Electronics Forum | Thu Jun 27 11:22:03 EDT 2002 | robbied
Hi there. We have had an out of control reflow oven that has allowed its temperature to fluctuate by up to +/- 20 deg C from set point in very short periods of time. We found the root cause of the problem and fixed it, but by then we had already run
Electronics Forum | Wed Jul 24 04:23:42 EDT 2002 | harisfaisal
Juan, I believe in term of height vs volume, volume is much better control. By the way we used Cyber Sentry 2000 which allows us to measure volume, height and area. My plant normal practice is measuring the height. Last time I did the control limit
Electronics Forum | Mon Jan 20 13:51:12 EST 2003 | slthomas
I seem to recall seeing some references to controlling the time above 205�C as a critical parameter, although I can't find it in the archives anywhere other than one reference to a maximum of 45 seconds. What's ideal (typically....I realize differen
