Electronics Forum: controller (Page 236 of 369)

Re: Srceen Printing control parameters

Electronics Forum | Thu Aug 19 19:10:31 EDT 1999 | Brian Wycoff

| | | | Hello, | | | | | | | | Can any netters suggest what critical parameters should be considered & what are there assoicated impacts for a solder paste printing process ... | | | | | | | | B.Regards, | | | | Felix | | | | | | | I have a proce

Re: Solder Beading Solder Balling

Electronics Forum | Thu Aug 05 08:39:26 EDT 1999 | Wayne Sanita

| | | Hello, If you are using no-clean and they are entrapped in the flux it is also IPC accepted but i havent found a customer yet who agrees with that. Im sure you have checked your profile. I had the same problem with chip components but after c

Re: Solder Beading Solder Balling

Electronics Forum | Thu Aug 05 10:55:09 EDT 1999 | Wolfgang Busko

| | | | | | Hello, | If you are using no-clean and they are entrapped in the flux it is also IPC accepted but i havent found a customer yet who agrees with that. Im sure you have checked your profile. I had the same problem with chip components but

Re: castellations vs. no castellations

Electronics Forum | Tue Jul 27 16:30:35 EDT 1999 | Earl Moon

| Can anyone give me the virtues of SMT package castellations vs. no castellations with particular reference to the ruggedness and reliability of the solder joints? Any references or studies that you can point me to? Also, although I'm in favor of

Re: Solder Paste Testing

Electronics Forum | Sat Jul 24 00:31:21 EDT 1999 | Scott McKee

| Has anyone ever heard of testing solder paste quality by pasting a board and making a determination of the quality by measuring paste height and width after the board is pasted. Would you consider this a valid test for solder paste testing? | I ag

Re: Profiling

Electronics Forum | Thu Jul 22 04:34:54 EDT 1999 | George Verboven

| Which among the two profiling method is more reliable/accurate in getting the oven thermal profile? | | a) using a HIGH-TEMP solder wire then soldering the thermocouples onto the profile points of the board (e.g. component lead etc.) | | b) not s

Re: Semi-Automatic Stencil Printing of Fine Pitch

Electronics Forum | Thu Jul 15 12:35:19 EDT 1999 | Earl Moon

| I use a Transition Automation Semi- Automatic stencil printer with laser cut frameless stencils. My solder paste is an SN63/PB37 RMA 291. I do not operate with in a controlled humidity enviroment. The room temp generally runs around 70 deg's but hu

Re: automatic stencil printers

Electronics Forum | Tue Jul 13 13:58:50 EDT 1999 | JohnW

| We are looking to automate the paste printing portion of our SMT process. We are looking at used equipment from DEK and MPM from 1994 onward.(DEK 260 & 265 MPM AP20 & AP27) Does anyone have some feedback or concerns with any of these machines? Does

Re: automatic stencil printers

Electronics Forum | Tue Jul 13 16:50:20 EDT 1999 | Boca

| We are looking to automate the paste printing portion of our SMT process. We are looking at used equipment from DEK and MPM from 1994 onward.(DEK 260 & 265 MPM AP20 & AP27) Does anyone have some feedback or concerns with any of these machines? Does

Re: viscosity measurements

Electronics Forum | Sat Jul 10 00:57:17 EDT 1999 | Scott

| who can tell me how viscosity measurements are really effective in smt process control? what can I monitor? Is it depending from fine pitch size? | Thanks a lot. | g. d'andrea | The last place I worked used a viscosity meter, funny how little was


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